5SGSMD4K3F40I3LG
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 19456000 360000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 412 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 135840 | Number of Logic Elements/Cells | 360000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 19456000 |
Overview of 5SGSMD4K3F40I3LG – Stratix® V GS FPGA, 360,000 logic elements, 1517‑BBGA
The 5SGSMD4K3F40I3LG is an Intel Stratix® V GS field‑programmable gate array supplied in a 1517‑ball FCBGA package. This industrial‑grade FPGA delivers high logic capacity, substantial on‑chip memory, and a large I/O count for densely integrated digital designs.
Designed for surface‑mount PCB deployment and rated for industrial operation, the device is targeted at applications that require significant programmable logic, abundant embedded memory, and a high pin‑count package while operating within a low core voltage range.
Key Features
- High logic density — 360,000 logic elements for implementing complex, large‑scale digital designs and custom hardware functionality.
- Embedded memory — approximately 19.46 Mbits of on‑chip RAM for buffering, state storage, and data‑path applications.
- Extensive I/O — 696 user I/O pins to support wide parallel interfaces and high‑pin‑count system integration.
- Package and mounting — 1517‑BBGA (FCBGA), supplier package 1517‑FBGA (40×40); surface‑mount form factor for compact, high‑density board layouts.
- Powering — Core supply specified at 820 mV to 880 mV, enabling low‑voltage core operation.
- Operating temperature — Industrial temperature grade with an operating range of −40 °C to 100 °C for deployment in temperature‑challenging environments.
- Compliance — RoHS compliant for adherence to environmental and materials requirements.
Typical Applications
- Industrial control and automation — Use the device where industrial temperature range and high logic density enable complex control algorithms and large I/O interfacing.
- High‑density digital systems — Suitable for boards that require a concentrated amount of programmable logic and embedded RAM in a single FCBGA package.
- Custom hardware acceleration — Deploy as a configurable accelerator for compute‑intensive functions that benefit from abundant logic resources and on‑chip memory.
Unique Advantages
- Large programmable fabric — 360,000 logic elements provide headroom for feature‑rich implementations without dividing functionality across multiple devices.
- Significant on‑chip memory — Approximately 19.46 Mbits of embedded RAM reduce the need for external memory for many buffering and state‑storage tasks.
- High I/O capacity — 696 I/O pins enable direct connection to numerous peripherals, sensors, or parallel buses, simplifying board‑level integration.
- Industrial reliability — Rated for −40 °C to 100 °C operation and RoHS compliant, supporting deployments in demanding environments while meeting environmental regulations.
- Compact, high‑pin‑count packaging — 1517‑BBGA/FCBGA package delivers large connector density in a compact footprint for space‑constrained systems.
- Low‑voltage core — Core supply range of 820–880 mV supports designs targeting lower core power domains.
Why Choose 5SGSMD4K3F40I3LG?
The 5SGSMD4K3F40I3LG combines substantial logic capacity, sizable embedded RAM, and a large I/O complement in a single industrial‑grade FCBGA package. Its specifications make it appropriate for designs that need consolidated programmable logic, extensive on‑chip resources, and reliable operation across a wide temperature range.
This device is well suited to engineers building compact, high‑density systems that require long‑term scalability and predictable environmental performance. Technical documentation for the Stratix V family provides the electrical and switching characteristics needed to evaluate device suitability for target designs.
Request a quote or submit an inquiry to obtain pricing, lead‑time, and availability for the 5SGSMD4K3F40I3LG. Our team can provide the details you need to move this device into your design cycle.

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