5SGSMD4K3F40I3G

The 5SGSMD4K3F40I3G is a Stratix V GS family Field Programmable Gate Array (FPGA) IC from Intel. It provides a high count of programmable logic resources, embedded RAM, and I/O in a 1517-ball FCBGA package targeted for industrial-temperature applications.

Its combination of large logic capacity, abundant I/O, and a low-voltage core supply makes it suitable for designs that require substantial on-chip logic and memory while operating across an industrial temperature range.

Key Features

• Logic Capacity  360,000 logic elements (LEs) for implementing large-scale, complex digital functions.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, lookup tables, and state storage.
• I/O Count  696 general-purpose I/O pins to interface with high-channel-count systems and peripherals.
• Power Supply  Core voltage supply range of 820 mV to 880 mV.
• Package & Mounting  1517-BBGA (FCBGA) supplier package: 1517-FBGA (40×40); surface-mount device suitable for compact, high-density board designs.
• Temperature Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density digital processing  Large logic capacity and on-chip RAM allow implementation of complex data-paths and custom processing pipelines.
• I/O-intensive systems  High pin count supports designs that require extensive peripheral and bus interfacing.
• Industrial equipment  Industrial temperature rating enables deployment in factory, instrumentation, and control environments where extended temperature range is required.

Unique Advantages

• Large programmable fabric: 360,000 logic elements provide headroom for complex, multi-function FPGA designs.
• Substantial on-chip memory: Approximately 19.456 Mbits of embedded RAM reduces dependence on external memory for many buffering and caching tasks.
• Extensive I/O availability: 696 I/O pins simplify integration with multi-channel sensors, interfaces, and high-pin-count boards.
• Industrial robustness: Rated for −40 °C to 100 °C operation to meet demanding environmental requirements.
• Compact, high-density packaging: 1517-ball FCBGA (40×40) package enables dense board layouts while supporting surface-mount assembly.
• Regulatory compliance: RoHS compliance supports environmentally conscious design requirements.

Why Choose 5SGSMD4K3F40I3G?

The 5SGSMD4K3F40I3G offers a balanced combination of high logic density, significant embedded memory, and a large I/O complement in an industrial-temperature, FCBGA package. These attributes make it appropriate for designers who need substantial on-chip resources and reliable operation across a wide temperature range.

As a member of the Stratix V GS family from Intel, this device aligns with established device families and documentation for system-level planning, enabling scalable designs that leverage the series’ device characteristics.

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