5SGSMD5K2F40I3L
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 39936000 457000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 472 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 172600 | Number of Logic Elements/Cells | 457000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 39936000 |
Overview of 5SGSMD5K2F40I3L – Stratix® V GS FPGA, 457,000 logic elements, ~39.936 Mbits RAM, 696 I/O
The 5SGSMD5K2F40I3L is an Intel Stratix V GS field programmable gate array (FPGA) offered in an industrial temperature grade. It delivers high logic density and substantial on-chip memory for complex, high‑I/O embedded and system designs. Typical use cases include high-performance digital signal processing, protocol bridging, and large‑scale logic consolidation where many I/Os and embedded RAM are required.
Key Features
- Core Logic 457,000 logic elements suitable for implementing large, complex logic functions and deep datapaths.
- Embedded Memory Approximately 39.936 Mbits of on‑chip RAM to support buffering, FIFOs, and local data storage without external memory.
- I/O Density 696 I/O pins to support wide parallel interfaces, high‑pincount peripherals, and multi‑lane connectivity.
- Power Core voltage supply range of 820 mV to 880 mV, reflecting the device’s low‑voltage core operating window.
- Package & Mounting 1517‑BBGA (FCBGA) package; supplier device package listed as 1517‑FBGA (40×40). Surface mount package for high‑density board implementations.
- Temperature Range Industrial operating temperature from −40 °C to 100 °C for deployments in demanding environments.
- Environmental Compliance RoHS compliant.
Typical Applications
- High‑Performance Signal Processing Leverage large logic capacity and embedded RAM for DSP pipelines, filtering, and real‑time data manipulation.
- Data Aggregation and Bridging Use high I/O count to connect and translate between multiple parallel and serial interfaces in communication systems and data acquisition.
- System Integration Consolidate multiple discrete functions into a single programmable device to reduce board complexity and BOM count.
- Industrial Control Industrial temperature grade and robust package make it suitable for control, monitoring, and automation equipment operating across wide temperature ranges.
Unique Advantages
- High Logic Density: 457,000 logic elements enable large designs and extensive custom logic integration without partitioning across multiple devices.
- Substantial On‑Chip Memory: Approximately 39.936 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage needs.
- Extensive I/O Count: 696 I/Os support broad connectivity options for multi‑channel systems and complex board-level interfaces.
- Industrial Temperature Rating: Rated from −40 °C to 100 °C for use in temperature‑challenging environments.
- High‑Pin‑Count FCBGA Package: 1517‑BBGA (1517‑FBGA, 40×40) provides the pin density required for high‑bandwidth, multi‑interface designs.
- RoHS Compliant: Environmentally compliant for deployment in regions and programs that require lead‑free components.
Why Choose 5SGSMD5K2F40I3L?
The 5SGSMD5K2F40I3L Stratix V GS FPGA combines high logic density, significant embedded memory, and a very large I/O complement in an industrial‑grade package. It is positioned for engineers designing complex, high‑I/O systems that require substantial on‑chip resources and operation across a wide temperature range.
This device is appropriate for teams looking to consolidate multiple functions into a single programmable device, reduce external memory dependencies, and maintain robust operation in demanding industrial environments.
Request a quote or submit an inquiry for pricing and availability to evaluate 5SGSMD5K2F40I3L for your next design.

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