5SGSMD5K2F40I3LNCV
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 39936000 457000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 749 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 172600 | Number of Logic Elements/Cells | 457000 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 39936000 |
Overview of 5SGSMD5K2F40I3LNCV – Stratix® V GS FPGA, 457,000 logic elements, ~39.9 Mbits RAM, 696 I/Os, 1517‑BBGA
The 5SGSMD5K2F40I3LNCV is an Intel Stratix V GS field-programmable gate array supplied in a 1517‑BBGA (FCBGA) package. It delivers very high logic capacity and on-chip memory with a large I/O count for complex, high‑density designs.
Designed and specified for industrial use, this device supports a core supply voltage range of 820 mV to 880 mV and an operating temperature range from −40 °C to 100 °C, enabling deployment in systems that require extended ambient tolerance and robust electrical characteristics.
Key Features
- High Logic Capacity — 457,000 logic elements (LEs) to implement large, compute‑intensive logic designs and extensive custom logic functions.
- On‑Chip Memory — Approximately 39.936 Mbits of embedded memory for buffering, packet storage, and on‑device data processing.
- Extensive I/O — 696 programmable I/Os to support dense interface requirements and multi‑lane connectivity.
- Industrial Grade — Device grade listed as Industrial with an operating temperature range of −40 °C to 100 °C for extended environmental tolerance.
- Low‑voltage Core — Core supply specified from 820 mV to 880 mV to match low‑voltage power domains and optimize system power architecture.
- Package & Mounting — 1517‑BBGA (supplier package: 1517‑FBGA, 40 × 40) in a surface‑mount FCBGA format to support compact, high‑density board designs.
- Standards Compliance — RoHS compliant for regulatory and environmental alignment.
Typical Applications
- High‑density logic implementations — Use the 457,000 logic elements to consolidate complex state machines, datapaths, or custom processing engines on a single device.
- On‑device buffering and memory‑intensive tasks — Approximately 39.9 Mbits of embedded RAM supports packet buffering, frame storage, and large lookup tables without external memory.
- I/O‑heavy interface aggregation — 696 I/Os enable aggregation of many peripheral buses, multiple SerDes lanes, or parallel interfaces on a single FPGA footprint.
- Industrial systems — Industrial grade and −40 °C to 100 °C operating range suit deployments in factory automation, industrial networking, and other environments with extended temperature requirements.
Unique Advantages
- Large single‑device integration: High logic and memory capacity reduce the need for multiple devices, simplifying system architecture and lowering BOM complexity.
- High I/O density: 696 I/Os provide flexibility for complex board topologies and multi‑protocol interfacing without external multiplexing.
- Industrial reliability: Industrial grade with broad operating temperature range supports more demanding deployment scenarios and long‑life applications.
- Compact high‑density package: 1517‑BBGA FCBGA package enables a small PCB footprint while maintaining signal density for advanced system designs.
- RoHS compliant: Meets environmental compliance expectations for commercial and industrial electronic products.
Why Choose 5SGSMD5K2F40I3LNCV?
This Stratix V GS device combines very high logic and embedded memory capacity with a large number of I/Os in a compact FCBGA package, making it suitable for designs that require substantial on‑chip resources and dense interfacing. Its industrial grading and specified operating temperature and voltage ranges support robust performance in environments that demand wider tolerance margins.
Choose 5SGSMD5K2F40I3LNCV for system designs that prioritize integration, on‑device memory, and high I/O counts while maintaining compliance and industrial robustness. The device aligns with designs that need scalable logic density and consolidated silicon to simplify board design and reduce component count.
Request a quote or submit an inquiry for 5SGSMD5K2F40I3LNCV to discuss availability, pricing, and lead times for your design requirements.

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