5SGSMD5K3F40C2

The 5SGSMD5K3F40C2 is a Stratix® V GS field-programmable gate array (FPGA) IC from Intel, supplied in a 1517-BBGA (1517-FBGA / 40×40) FCBGA surface-mount package. This commercial-grade device delivers high on-chip logic capacity, sizable embedded memory, and a large I/O count for complex programmable logic designs.

With 457,000 logic elements, approximately 39.9 Mbits of embedded RAM, and 696 I/Os, the device targets applications that require high-density programmable logic, extensive on-chip memory, and broad external connectivity while operating within a commercial temperature range.

Key Features

• Core Logic 457,000 logic elements (logic cells) to implement complex custom logic and parallel datapaths.
• Embedded Memory Approximately 39.9 Mbits of on-chip RAM for buffering, FIFOs, and memory-mapped designs.
• I/O Capacity 696 user I/Os to support extensive peripheral interfacing and multi-channel connectivity.
• Package and Mounting 1517-BBGA (FCBGA) package—supplier device package 1517-FBGA (40×40); surface-mount for PCB integration.
• Power Core supply voltage range specified at 870 mV to 930 mV to match system power-architecture requirements.
• Temperature Grade Commercial operating temperature range of 0 °C to 85 °C for standard electronic systems.
• Compliance RoHS-compliant to support environmental regulations for lead-free manufacturing.

Typical Applications

• High-density programmable logic — Use the device where large combinational and sequential logic resources are required for custom hardware functions.
• On-chip buffering and memory-intensive designs — Leverage approximately 39.9 Mbits of embedded RAM for data buffering, packet staging, and FIFO implementations.
• Multi-interface systems — 696 I/Os enable broad external connectivity for boards that require numerous peripherals, sensors, or parallel interfaces.

Unique Advantages

• High logic capacity: 457,000 logic elements allow implementation of large, complex designs without immediate need for external logic expansion.
• Substantial on-chip memory: Approximately 39.9 Mbits of RAM reduces reliance on external memory for many buffering and temporary storage tasks.
• Extensive I/O availability: 696 I/Os simplify routing multiple interfaces and peripherals without port multiplexing.
• Compact system footprint: 1517-BBGA FCBGA surface-mount package provides a high-density physical solution for space-constrained PCBs.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation to match standard commercial electronic deployments.
• Regulatory alignment: RoHS compliance supports lead-free manufacturing and environmental requirements.

Why Choose 5SGSMD5K3F40C2?

The 5SGSMD5K3F40C2 combines a large logic fabric, ample embedded memory, and a high I/O count in a compact FCBGA package, making it well suited for designers who need a dense, programmable platform for complex logic, extensive interfacing, and significant on-chip buffering. Its defined core voltage range and commercial temperature rating make it appropriate for standard electronic systems where performance and integration are priorities.

Backed by the Stratix V device family documentation and Intel’s FPGA ecosystem, this part provides a scalable option for customers developing high-capacity programmable solutions that require verified electrical characteristics and packaging suitable for surface-mount assembly.

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