5SGSMD5K3F40C2G

The 5SGSMD5K3F40C2G is a Stratix V GS field-programmable gate array (FPGA) from Intel, delivered in a 1517-BBGA FCBGA package. It provides high on-chip logic capacity and memory with a broad I/O count suitable for demanding, high-density programmable-logic designs.

This commercial-grade device offers 457,000 logic elements, approximately 39.9 Mbits of embedded memory, and up to 696 I/O pins, with a core supply range of 870 mV to 930 mV and an operating temperature range of 0 °C to 85 °C.

Key Features

• Core Logic Capacity — 457,000 logic elements to support large, complex logic implementations and high-level integration.
• Embedded Memory — Approximately 39.9 Mbits of on-chip RAM for buffering, state storage, and algorithm acceleration.
• High I/O Count — 696 I/O pins to accommodate extensive peripheral connectivity and parallel interfaces.
• Power and Voltage — Core supply voltage range from 870 mV to 930 mV, enabling compatibility with low-voltage system domains.
• Package & Mounting — Supplied in a 1517-BBGA (1517-FBGA, 40 × 40) footprint for surface-mount board assembly.
• Commercial Grade & Temperature — Rated for commercial use with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High-density programmable logic — Implement large-scale custom logic and control functions using 457,000 logic elements and abundant on-chip memory.
• Memory-intensive processing — Leverage approximately 39.9 Mbits of embedded RAM for buffering, packet processing, or stream-handling tasks.
• Large I/O systems — Support extensive peripheral arrays, multi-channel interfaces, and parallel I/O fabrics with 696 I/O pins.

Unique Advantages

• Highly integrated logic capacity: 457,000 logic elements reduce the need for multiple devices in dense designs.
• Substantial on-chip memory: Approximately 39.9 Mbits of embedded RAM minimizes off-chip memory dependencies and simplifies board design.
• Extensive connectivity: 696 I/O pins provide flexibility for complex interfacing and multi-channel systems.
• Low-voltage core compatibility: Operates from 870 mV to 930 mV to match modern low-voltage system requirements.
• Board-level packaging: 1517-BBGA FCBGA (1517-FBGA, 40 × 40) surface-mount package supports compact, high-density PCB layouts.
• Commercial temperature operation: Rated 0 °C to 85 °C for standard commercial deployments.

Why Choose 5SGSMD5K3F40C2G?

The 5SGSMD5K3F40C2G positions itself as a high-density Stratix V GS FPGA option for designs that demand significant logic resources, substantial on-chip memory, and broad I/O capability within a commercial temperature envelope. Its combination of logic elements, embedded RAM, and I/O makes it suitable for consolidating complex functions into a single programmable device.

As a member of the Stratix V family from Intel, this device is documented in the Stratix V device datasheet for electrical and switching characteristics, providing the technical detail engineers need to evaluate power, timing, and operating conditions for system integration.

Request a quote or submit an inquiry to obtain pricing, lead time, and availability for the 5SGSMD5K3F40C2G.