5SGSMD5K2F40I3WN
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 39936000 457000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 531 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 172600 | Number of Logic Elements/Cells | 457000 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 39936000 |
Overview of 5SGSMD5K2F40I3WN – Stratix® V GS FPGA, 457,000 logic elements
The 5SGSMD5K2F40I3WN is an Intel Stratix® V GS field programmable gate array (FPGA) in a 1517-BBGA FCBGA package. It delivers high logic capacity and extensive I/O in a surface-mount Ball Grid Array package targeted at industrial-grade designs.
With a large number of logic elements, substantial on-chip memory, and a wide operating temperature range, this device is suited to FPGA-based systems that require dense logic integration, significant embedded memory, and robust operation across -40 °C to 100 °C.
Key Features
- Core Logic Approximately 457,000 logic elements provide large-scale programmable logic capacity for complex digital designs.
- Embedded Memory Approximately 39.9 Mbits of embedded memory to support buffering, on-chip data storage, and memory-intensive logic functions.
- I/O Resources 696 general-purpose I/O pins for broad peripheral and system interfacing without external I/O expansion.
- Power Core voltage supply range from 0.820 V to 0.880 V, enabling operation within a defined low-voltage core window.
- Package & Mounting 1517-BBGA (FCBGA) package, supplied as 1517-FBGA (40×40) and designed for surface-mount assembly to support compact board-level integration.
- Temperature & Grade Industrial grade with an operating temperature range of -40 °C to 100 °C for use in demanding environments.
- Regulatory RoHS compliant, meeting common environmental substance restrictions.
Typical Applications
- High-density logic systems Designs that require large programmable logic capacity and significant on-chip memory for complex algorithms and state machines.
- I/O-intensive platforms Systems that need hundreds of I/Os for sensor arrays, multi-channel interfaces, or dense peripheral connectivity.
- Industrial control and automation Embedded systems operating across wide temperatures where industrial-grade components are required.
- Compact, board-level integration Applications that benefit from FCBGA packaging and surface-mount assembly to minimize PCB footprint.
Unique Advantages
- Large programmable fabric: Approximately 457,000 logic elements enable complex functionality integration on a single device and reduce external logic counts.
- Substantial on-chip memory: Approximately 39.9 Mbits of embedded RAM supports data buffering and localized storage without external memory in many use cases.
- Extensive I/O count: 696 I/Os simplify system design by providing abundant direct interfaces to peripherals and subsystems.
- Industrial readiness: Rated for -40 °C to 100 °C operation to meet environmental demands typical of industrial applications.
- Space-efficient package: 1517-BBGA (40×40) FCBGA package enables compact board layouts while supporting high pin counts.
- RoHS compliance: Reduces environmental compliance burden for assembly and deployment.
Why Choose 5SGSMD5K2F40I3WN?
The 5SGSMD5K2F40I3WN positions itself as a high-capacity Stratix V GS FPGA option for engineers who need substantial logic resources, embedded memory, and a large number of I/Os in an industrial-grade package. Its defined core voltage window and FCBGA surface-mount packaging support efficient power and board integration considerations.
This device is well suited to designs that demand on-chip integration to reduce external components and to operate reliably across a wide temperature range. Backed by Intel's Stratix V device documentation, it is appropriate for development workflows that reference the Stratix V series electrical and operating specifications.
Request a quote or submit a sales inquiry to get pricing and availability for the 5SGSMD5K2F40I3WN.

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