5SGSMD5K2F40I3LN

The 5SGSMD5K2F40I3LN is a Stratix V GS Field Programmable Gate Array (FPGA) from Intel, presented in a 1517-BBGA FCBGA (1517-FBGA 40×40) package and rated for industrial operation. This high-density device integrates 457,000 logic elements and approximately 39.9 Mbits of embedded memory, together with 696 I/O pins, enabling complex, high‑channel-count designs that require substantial on-chip logic and memory resources.

Designed for surface-mount assembly and RoHS compliance, the device operates from a core supply range of 820 mV to 880 mV and across an industrial temperature range of −40 °C to 100 °C.

Key Features

• Core Logic 457,000 logic elements (cells) for high-density programmable logic integration and large-scale FPGA designs.
• Embedded Memory Approximately 39.9 Mbits of on-chip RAM to support buffering, caching, and intermediate data storage without external memory.
• I/O Capacity 696 I/O pins to support extensive peripheral, parallel, and multi-channel interfaces in complex systems.
• Package & Mounting 1517-BBGA FCBGA package (supplier: 1517-FBGA, 40×40) in a surface-mount form factor for dense PCB integration.
• Power Core supply voltage specified between 820 mV and 880 mV to match system power-rail planning and power-delivery design.
• Temperature & Grade Industrial-grade device rated for operation from −40 °C to 100 °C for deployment in extended-temperature environments.
• Regulatory RoHS compliant to meet lead-free and environmental regulatory requirements.

Typical Applications

• High-density logic integration — Implement large custom logic blocks and complex state machines where substantial on-chip resources are required.
• Multi-channel I/O systems — Support designs needing hundreds of I/O pins for parallel data paths, sensor arrays, or multi-interface boards.
• Industrial systems with extended temperature needs — Deploy in environments requiring operation from −40 °C to 100 °C while retaining high logic and memory capacity.

Unique Advantages

• Massive logic capacity: 457,000 logic elements enable consolidation of multiple functions into a single device, reducing external components.
• Substantial on-chip RAM: Approximately 39.9 Mbits of embedded memory lowers dependence on external DRAM for many buffering and storage tasks.
• Extensive I/O count: 696 I/Os simplify board-level routing for high-channel or multi-interface applications without multiplexing compromises.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in challenging thermal environments.
• Compact BGA package: 1517-FBGA (40×40) delivers a high-pin-count solution in a compact surface-mount footprint for space-constrained PCBs.
• Low-voltage core operation: 820 mV–880 mV core supply range supports modern power-delivery architectures.

Why Choose 5SGSMD5K2F40I3LN?

The 5SGSMD5K2F40I3LN combines high logic density, large embedded memory, and a very high I/O count in an industrial-grade Stratix V GS FPGA package. Its specifications make it suitable for designs that require consolidated functionality, significant on-chip data storage, and broad interfacing capability while operating over an extended temperature range.

As part of the Stratix V family and provided in a compact 1517-FBGA package, this device addresses demanding design requirements where integration, reliability, and predictable electrical characteristics (including a defined core voltage window) are key selection criteria.

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