5SGSMD5K2F40I3N

The 5SGSMD5K2F40I3N is an Intel Stratix® V GS field programmable gate array supplied in a 1517‑pin FCBGA package. It delivers very high logic density and on‑chip memory in a surface‑mount footprint designed for industrial applications.

With 457,000 logic elements, approximately 39.9 Mbits of embedded memory and 696 I/Os, this device targets designs that require large programmable fabric, significant embedded RAM, and substantial I/O capacity while operating over an industrial temperature range.

Key Features

• High Logic Density  457,000 logic elements for implementing large, complex programmable logic designs.
• Embedded Memory  Approximately 39.9 Mbits of on‑chip RAM to support data buffering, state storage, and on‑device algorithms.
• High I/O Count  696 general‑purpose I/Os to accommodate wide parallel interfaces, multi‑lane connectivity, and extensive peripheral integration.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, suitable for industrial environments and temperature‑challenging installations.
• Low‑Voltage Core  Core voltage supply specified between 820 mV and 880 mV, aligning with modern low‑voltage FPGA core rails.
• Package and Mounting  1517‑BBGA (1517‑FBGA supplier package, 40×40 mm) in a surface‑mount FCBGA format for high‑density board integration.
• Regulatory Compliance  RoHS‑compliant to meet environmental and manufacturing requirements.

Typical Applications

• Industrial Control Systems  Large programmable logic and wide I/O counts support complex control, I/O aggregation, and deterministic processing in industrial equipment.
• High‑Performance Embedded Systems  Substantial on‑chip RAM and logic resources enable embedded compute tasks, protocol bridging, and custom accelerators.
• Interface and I/O Expansion  High I/O density is ideal for designs requiring multiple parallel interfaces, sensor arrays, or large peripheral sets.

Unique Advantages

• Substantial On‑Device Logic:  457,000 logic elements allow integration of large functionality into a single device, reducing external component count.
• Large Embedded Memory:  Approximately 39.9 Mbits of RAM supports buffering, look‑up tables, and data‑intensive algorithms without external memory.
• Extensive I/O Capability:  696 I/Os simplify system routing and enable direct interfacing to many peripherals and subsystems.
• Industrial Reliability:  −40 °C to 100 °C operating range and surface‑mount FCBGA packaging support deployment in demanding industrial environments.
• Compact, High‑Pin Package:  The 1517‑pin BBGA (40×40 mm) package balances pin count and PCB area for high‑density applications.
• Compliance‑Ready:  RoHS compliance supports environmentally conscious manufacturing and deployment.

Why Choose 5SGSMD5K2F40I3N?

The 5SGSMD5K2F40I3N positions itself as a high‑density FPGA solution for industrial and advanced embedded designs that require significant programmable logic, abundant on‑chip memory, and a large number of I/Os in a compact FCBGA package. Its industrial temperature rating and RoHS compliance make it suitable for long‑lifecycle deployments where environmental tolerance and regulatory adherence matter.

Design teams seeking to consolidate complex functions onto a single device—reducing board-level component count and simplifying system architecture—will find the device’s capacity, memory, and I/O resources well suited to scalable, robust designs.

If you would like pricing, availability, or additional technical information for 5SGSMD5K2F40I3N, request a quote or submit an inquiry to get the details you need to evaluate this device for your next design.