5SGSMD6K2F40C3N

The 5SGSMD6K2F40C3N is a Stratix® V GS Field Programmable Gate Array (FPGA) from Intel. It provides a high-density programmable logic fabric with a large embedded memory resource and a high I/O count for complex digital designs.

Designed for commercial-grade applications, this surface-mount FCBGA device combines substantial logic capacity, on-chip RAM, and broad I/O integration to support demanding system functions that require programmable hardware acceleration and flexible I/O connectivity.

Key Features

• High-density logic — 583,000 logic elements to implement large-scale logic, control, and datapath functions.
• Embedded memory — Approximately 46 Mbits of on-chip RAM for buffering, FIFOs, and on-chip data storage.
• Extensive I/O — 696 user I/Os to support wide parallel interfaces and high-pin-count system connections.
• Package and mounting — 1517-BBGA FCBGA (supplier package: 1517-FBGA, 40×40) in a surface-mount form factor for PCB integration.
• Power — Core supply voltage range of 820 mV to 880 mV to align with system power design constraints.
• Commercial temperature grade — Rated for 0 °C to 85 °C operation for standard commercial-environment deployments.
• Compliance — RoHS-compliant to meet common environmental and manufacturing requirements.

Typical Applications

• High-density logic integration — Implement complex state machines, protocol handlers, and hardware-accelerated algorithms using the device’s large logic element count.
• On-chip buffering and memory-intensive functions — Use the approximately 46 Mbits of embedded memory for packet buffering, data queues, and temporary storage in streaming applications.
• High-pin-count system interfaces — Leverage 696 I/Os for wide parallel buses, multiple peripheral interfaces, and complex I/O routing on a single device.

Unique Advantages

• Substantial programmable capacity: 583,000 logic elements provide headroom for large designs and multi-function integration on a single FPGA.
• Significant on-chip memory: Approximately 46 Mbits of embedded RAM reduces the need for external memory in many buffer and streaming use cases.
• High I/O density: 696 I/Os simplify board-level connectivity by consolidating multiple interfaces into one device footprint.
• Compact FCBGA package: The 1517-BBGA (1517-FBGA, 40×40) package delivers high integration in a surface-mount form factor suitable for dense PCB layouts.
• Commercial operating range: 0 °C to 85 °C rating aligns with standard commercial deployments and system thermal designs.
• RoHS-compliant: Supports environmentally conscious manufacturing requirements.

Why Choose 5SGSMD6K2F40C3N?

The 5SGSMD6K2F40C3N delivers a balance of large logic capacity, substantial embedded memory, and high I/O count in a compact FCBGA package. Its specifications make it suitable for designs that require dense programmable logic and on-chip RAM while maintaining a commercial temperature profile and RoHS compliance.

This FPGA is a practical choice for development teams needing to consolidate functions onto a single, high-capacity device—reducing board-level complexity and supporting scalable designs backed by Intel’s Stratix V family lineage.

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