5SGSMD6K2F40I2LN
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 46080000 583000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 1,621 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 220000 | Number of Logic Elements/Cells | 583000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGSMD6K2F40I2LN – Stratix V GS FPGA, 696 I/Os, 1517‑FBGA (40×40)
The Intel 5SGSMD6K2F40I2LN is a Stratix® V GS family field-programmable gate array (FPGA) supplied in a 1517‑FBGA (40×40) surface-mount package. It delivers high logic density, substantial on-chip memory, and a large I/O count in an industrial temperature–grade device.
This device is intended for system designs that require significant programmable logic capacity, on-chip memory resources, and broad I/O integration while operating across an extended industrial temperature range.
Key Features
- Core logic density Contains 583,000 logic elements to support complex programmable logic and large-scale digital designs.
- Embedded memory Provides approximately 46 Mbits of on-chip RAM for buffering, data storage, and algorithmic state retention without external memory.
- High I/O count Offers 696 user I/Os to support dense peripheral and system interfacing requirements.
- Power domain Operates from a core supply range of 820 mV to 880 mV, supporting regulated low-voltage core operation.
- Package & mounting Delivered in a 1517‑FBGA (40×40) FCBGA package suitable for surface-mount PCB assembly and compact board layouts.
- Industrial temperature grade Rated for operation from −40 °C to 100 °C for deployment in temperature-demanding environments.
- Regulatory compliance RoHS compliant.
Typical Applications
- Industrial control systems Industrial temperature rating and high logic density enable deployment in control and automation equipment that must operate over a wide temperature range.
- I/O‑intensive subsystems The 696 I/Os support designs with many peripherals, sensors, or external interfaces requiring extensive connectivity.
- On-chip memory–dependent designs Approximately 46 Mbits of embedded RAM allow for significant buffering, packet processing, or local data storage without immediate external memory needs.
Unique Advantages
- High logic capacity: 583,000 logic elements enable implementation of complex algorithms and wide parallelism on a single device, reducing the need for additional FPGAs.
- Substantial embedded memory: Approximately 46 Mbits of on-chip RAM minimizes external memory dependencies for many data-intensive functions.
- Extensive I/O connectivity: 696 I/Os provide flexible interfacing options for dense system integration and multiple peripheral domains.
- Industrial temperature operation: Rated −40 °C to 100 °C for use in environments with elevated or variable temperatures.
- Compact surface‑mount package: 1517‑FBGA (40×40) FCBGA supports compact PCB designs while maintaining high pin density.
- RoHS compliant: Conforms to RoHS requirements for lead‑free assembly and environmental compliance.
Why Choose 5SGSMD6K2F40I2LN?
The 5SGSMD6K2F40I2LN balances high logic density, significant embedded memory, and a wide I/O complement in an industrial-grade Stratix V GS FPGA. These attributes make it suitable for system designs that require substantial programmable logic capacity and on-chip resources while maintaining operation across an extended temperature range.
Customers building complex industrial or I/O‑dense systems will find the device’s integration level and package options helpful for reducing board count and simplifying system architecture, while RoHS compliance supports modern assembly and environmental requirements.
If you would like pricing, availability, or a formal quote for 5SGSMD6K2F40I2LN, submit a product inquiry or request a quote through your procurement channel.

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