5SGSMD6K2F40I3LN
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 46080000 583000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 419 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 220000 | Number of Logic Elements/Cells | 583000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGSMD6K2F40I3LN – Stratix® V GS FPGA, 583000 logic elements, 696 I/Os
The 5SGSMD6K2F40I3LN is a Stratix® V GS Field Programmable Gate Array (FPGA) IC designed for high-density, I/O-rich designs. It combines a large logic fabric with substantial embedded memory and a high pin count to address complex digital processing and integration requirements.
Targeted at industrial applications, this device offers a broad operating temperature range and a compact FCBGA package to support reliable system integration where robust environmental performance and board-level density are required.
Key Features
- Core logic 583,000 logic elements (cells) for large-scale programmable logic and complex design implementations.
- Embedded memory Approximately 46 Mbits of on-chip RAM to support buffering, state storage, and data-intensive processing.
- I/O density 696 user I/O pins to accommodate multi-channel interfaces and dense peripheral connectivity.
- Power supply Core voltage supply range of 820 mV to 880 mV, enabling defined low-voltage operation.
- Package & mounting 1517-BBGA FCBGA (supplier package: 1517-FBGA, 40×40); surface-mount package for compact PCB integration.
- Temperature & grade Industrial grade with an operating temperature range of –40 °C to 100 °C for extended environmental tolerance.
- Environmental compliance RoHS compliant.
Typical Applications
- Logic‑intensive systems Designs that require large programmable logic capacity and extensive on-chip resources for complex algorithms and control logic.
- I/O‑heavy applications Systems needing a high number of external interfaces or parallel I/O channels that benefit from 696 user I/Os.
- Industrial embedded platforms Industrial control and embedded systems operating in a wide temperature range that require durable, industrial‑grade components.
- Compact, board‑level integration Space-constrained designs that leverage the 1517-FBGA (40×40) FCBGA package and surface-mount assembly.
Unique Advantages
- Substantial programmable capacity: 583,000 logic elements enable large designs to be implemented within a single device, reducing the need for multi‑FPGA partitioning.
- On‑chip memory for data handling: Approximately 46 Mbits of embedded RAM supports buffering, lookup tables, and state retention without external memory dependence.
- High interface count: 696 I/Os allow dense external connectivity for multi-channel systems, sensors, and peripheral interfaces.
- Industrial temperature rating: –40 °C to 100 °C operating range helps maintain functionality across demanding environmental conditions.
- Compact FCBGA packaging: 1517-FBGA (40×40) enables high density on PCB designs while supporting surface-mount assembly workflows.
- Regulatory readiness: RoHS compliance simplifies environmental compliance for manufacturing and deployment.
Why Choose 5SGSMD6K2F40I3LN?
The 5SGSMD6K2F40I3LN positions itself as a high‑capacity Stratix V GS FPGA option for engineers who need a combination of extensive logic resources, significant on‑chip memory, and a large number of I/Os within an industrial temperature footprint. Its FCBGA packaging and surface‑mount form factor make it suitable for compact, board‑level system designs where density and environmental robustness are priorities.
This device is well suited for teams designing complex digital systems that require scalability of logic and memory resources while maintaining defined voltage and temperature operating conditions. Its feature set supports streamlined system integration and long-term deployment in industrial environments.
Request a quote or submit a price and availability inquiry to evaluate the 5SGSMD6K2F40I3LN for your next design project.

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