5SGSMD6K2F40I3LG
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 46080000 583000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 1,714 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 220000 | Number of Logic Elements/Cells | 583000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGSMD6K2F40I3LG – Stratix® V GS Field Programmable Gate Array, 1517-BBGA (FCBGA)
The 5SGSMD6K2F40I3LG is a Stratix® V GS field programmable gate array (FPGA) IC designed for industrial-grade applications. It delivers a large programmable fabric with approximately 583,000 logic elements and roughly 46 Mbits of embedded memory, paired with a high I/O count to support complex system designs.
This surface-mount FCBGA device is supplied in a 1517-BBGA package (supplier package: 1517-FBGA, 40×40) and is specified for operation from −40 °C to 100 °C with a core supply range of 820 mV to 880 mV, making it suitable for robust, temperature-demanding deployments.
Key Features
- Logic Capacity Approximately 583,000 logic elements for implementing large-scale digital logic and custom processing blocks.
- Embedded Memory Approximately 46 Mbits of on-chip RAM to support data buffering, signal processing, and state storage without immediate dependence on external memory.
- I/O Density 696 I/O pins to interface with high-pin-count peripherals, sensors, and external subsystems.
- Industrial Grade Temperature Rated for −40 °C to 100 °C operation, suitable for industrial environments that require extended temperature range.
- Power Supply Core voltage supply specified between 820 mV and 880 mV for controlled power and timing behavior.
- Package & Mounting 1517-BBGA (FCBGA) package, supplier specified as 1517-FBGA (40×40); surface-mount mounting type for PCB integration.
- Regulatory Status RoHS compliant.
Typical Applications
- Industrial Control High logic capacity and extended temperature rating enable complex control algorithms and deterministic I/O interfacing in industrial automation systems.
- High-Density Digital Processing Large on-chip RAM and substantial logic resources support data buffering, pipelined processing, and custom accelerators.
- Protocol Bridging and I/O Aggregation High I/O count allows consolidation of multiple interfaces and protocol conversion tasks onto a single device.
Unique Advantages
- High integration density: Approximately 583k logic elements and ~46 Mbits of embedded RAM reduce the need for multiple discrete logic devices and external memory in many designs.
- Extensive I/O provisioning: 696 I/O pins provide flexibility for complex peripheral and sensor connectivity without additional interface chips.
- Industrial-ready thermal range: Specified −40 °C to 100 °C operation supports deployments in temperature-variable industrial environments.
- Compact FCBGA package: 1517-BBGA (1517-FBGA, 40×40) surface-mount format allows dense PCB layouts while maintaining high pin count.
- Controlled core supply window: 820 mV to 880 mV core supply specification supports predictable power and timing behavior during integration and testing.
- RoHS compliant: Conforms to RoHS requirements for environmental and manufacturing compliance.
Why Choose 5SGSMD6K2F40I3LG?
The 5SGSMD6K2F40I3LG positions itself as a high-density, industrial-grade Stratix V GS FPGA well suited for designs that demand large programmable logic resources, significant on-chip memory, and a high number of I/Os in a compact FCBGA package. Its industrial temperature rating and defined core voltage range make it appropriate for systems that require predictable behavior across a wide thermal range.
Designers targeting complex control systems, high-density digital processing, or consolidated I/O solutions will find this device useful for reducing board-level complexity while retaining flexibility for custom logic and memory-intensive functions.
Request a quote or submit a procurement inquiry to evaluate how the 5SGSMD6K2F40I3LG can meet your design requirements and to obtain pricing and availability information.

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Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018