5SGSMD6K2F40I3LG

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 46080000 583000 1517-BBGA, FCBGA

Quantity 1,714 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs220000Number of Logic Elements/Cells583000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits46080000

Overview of 5SGSMD6K2F40I3LG – Stratix® V GS Field Programmable Gate Array, 1517-BBGA (FCBGA)

The 5SGSMD6K2F40I3LG is a Stratix® V GS field programmable gate array (FPGA) IC designed for industrial-grade applications. It delivers a large programmable fabric with approximately 583,000 logic elements and roughly 46 Mbits of embedded memory, paired with a high I/O count to support complex system designs.

This surface-mount FCBGA device is supplied in a 1517-BBGA package (supplier package: 1517-FBGA, 40×40) and is specified for operation from −40 °C to 100 °C with a core supply range of 820 mV to 880 mV, making it suitable for robust, temperature-demanding deployments.

Key Features

  • Logic Capacity  Approximately 583,000 logic elements for implementing large-scale digital logic and custom processing blocks.
  • Embedded Memory  Approximately 46 Mbits of on-chip RAM to support data buffering, signal processing, and state storage without immediate dependence on external memory.
  • I/O Density  696 I/O pins to interface with high-pin-count peripherals, sensors, and external subsystems.
  • Industrial Grade Temperature  Rated for −40 °C to 100 °C operation, suitable for industrial environments that require extended temperature range.
  • Power Supply  Core voltage supply specified between 820 mV and 880 mV for controlled power and timing behavior.
  • Package & Mounting  1517-BBGA (FCBGA) package, supplier specified as 1517-FBGA (40×40); surface-mount mounting type for PCB integration.
  • Regulatory Status  RoHS compliant.

Typical Applications

  • Industrial Control  High logic capacity and extended temperature rating enable complex control algorithms and deterministic I/O interfacing in industrial automation systems.
  • High-Density Digital Processing  Large on-chip RAM and substantial logic resources support data buffering, pipelined processing, and custom accelerators.
  • Protocol Bridging and I/O Aggregation  High I/O count allows consolidation of multiple interfaces and protocol conversion tasks onto a single device.

Unique Advantages

  • High integration density: Approximately 583k logic elements and ~46 Mbits of embedded RAM reduce the need for multiple discrete logic devices and external memory in many designs.
  • Extensive I/O provisioning: 696 I/O pins provide flexibility for complex peripheral and sensor connectivity without additional interface chips.
  • Industrial-ready thermal range: Specified −40 °C to 100 °C operation supports deployments in temperature-variable industrial environments.
  • Compact FCBGA package: 1517-BBGA (1517-FBGA, 40×40) surface-mount format allows dense PCB layouts while maintaining high pin count.
  • Controlled core supply window: 820 mV to 880 mV core supply specification supports predictable power and timing behavior during integration and testing.
  • RoHS compliant: Conforms to RoHS requirements for environmental and manufacturing compliance.

Why Choose 5SGSMD6K2F40I3LG?

The 5SGSMD6K2F40I3LG positions itself as a high-density, industrial-grade Stratix V GS FPGA well suited for designs that demand large programmable logic resources, significant on-chip memory, and a high number of I/Os in a compact FCBGA package. Its industrial temperature rating and defined core voltage range make it appropriate for systems that require predictable behavior across a wide thermal range.

Designers targeting complex control systems, high-density digital processing, or consolidated I/O solutions will find this device useful for reducing board-level complexity while retaining flexibility for custom logic and memory-intensive functions.

Request a quote or submit a procurement inquiry to evaluate how the 5SGSMD6K2F40I3LG can meet your design requirements and to obtain pricing and availability information.

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