5SGSMD6K2F40I2N

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 46080000 583000 1517-BBGA, FCBGA

Quantity 1,565 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs220000Number of Logic Elements/Cells583000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits46080000

Overview of 5SGSMD6K2F40I2N – Stratix® V GS FPGA, 583,000 Logic Elements, 696 I/Os

The 5SGSMD6K2F40I2N is an Intel Stratix® V GS field-programmable gate array (FPGA) in a 1517-BBGA (1517-FBGA, 40×40) surface-mount package. It delivers very high logic capacity and substantial on-chip memory for designs that require dense programmable logic, a large number of I/Os, and industrial operating range.

With approximately 583,000 logic elements, about 46 Mbits of embedded RAM, and 696 I/Os, this device targets applications that demand high integration, extensive I/O connectivity, and operation across a wide industrial temperature range.

Key Features

  • Core Capacity  Approximately 583,000 logic elements to implement large-scale programmable logic and complex designs.
  • Embedded Memory  Approximately 46 Mbits of on-chip RAM for buffering, packet storage, and memory-intensive logic functions.
  • I/O Density  696 I/Os to support dense peripheral connectivity and parallel interfaces without extensive external glue logic.
  • Voltage Supply  Core supply range of 870 mV to 930 mV for defined low-voltage core operation.
  • Package & Mounting  1517-BBGA (supplier package 1517-FBGA, 40×40) in a surface-mount form factor for board-level integration.
  • Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C for deployment in industrial environments.
  • Standards Compliance  RoHS-compliant construction for regulatory and environmental considerations.

Typical Applications

  • Industrial Control  High logic capacity and industrial temperature rating make the device suitable for motion control, PLCs, and factory automation systems requiring robust on-board processing and extensive I/O.
  • High-density Signal Processing  Large logic and embedded RAM allow implementation of complex DSP pipelines, data aggregation, and real-time processing functions.
  • Communications & Networking Equipment  Abundant I/O and memory support parallel interfaces and buffering for networking line cards, switches, and protocol processing modules.
  • Test & Measurement  High integration and I/O count enable configurable instrument front-ends, data capture, and custom analysis logic in measurement systems.

Unique Advantages

  • High integration density: Approximately 583,000 logic elements and ~46 Mbits of embedded RAM reduce the need for external FPGA-assisted components and simplify system architecture.
  • Extensive I/O resources: 696 I/Os provide flexibility to connect multiple peripherals, high-pin-count interfaces, and parallel data paths directly to the FPGA.
  • Industrial robustness: Rated for –40 °C to 100 °C operation, enabling deployment in temperature-demanding industrial environments.
  • Compact BGA footprint: 1517-BBGA (1517-FBGA, 40×40) surface-mount package balances high pin count with a compact board area.
  • Defined low-voltage core operation: 870–930 mV supply range aligns with low-voltage FPGA core domains for predictable power provisioning.
  • Environmentally compliant: RoHS-compliant construction supports regulatory requirements for electronics manufacturing.

Why Choose 5SGSMD6K2F40I2N?

The 5SGSMD6K2F40I2N positions itself as a high-capacity, industrial-grade member of the Stratix V GS family, combining large programmable logic resources, substantial embedded memory, and a very high I/O count in a compact BGA package. These attributes make it a fit for designers building complex, I/O-intensive systems that must operate reliably across extended temperature ranges.

Choosing this device provides a pathway to consolidate functionality on a single FPGA, reduce external component count, and maintain predictable operation in industrial settings—delivering scalability and system-level integration for demanding applications.

Request a quote or submit your procurement request to receive pricing and availability information for the 5SGSMD6K2F40I2N.

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