5SGSMD6K2F40I3N

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 46080000 583000 1517-BBGA, FCBGA

Quantity 1,113 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs220000Number of Logic Elements/Cells583000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits46080000

Overview of 5SGSMD6K2F40I3N – Stratix® V GS Field Programmable Gate Array (FPGA)

The 5SGSMD6K2F40I3N is a Stratix® V GS family FPGA in a 1517-BBGA FCBGA package designed for industrial-grade applications. It integrates a high logic capacity and substantial on-chip memory with a large I/O count to support complex, high-density programmable designs.

Key on-chip resources include approximately 583,000 logic elements, approximately 46 Mbits of embedded memory, and 696 I/O pins. The device operates over a core supply range of 820 mV to 880 mV and is specified for industrial temperatures from −40 °C to 100 °C.

Key Features

  • Core Logic Approximately 583,000 logic elements for implementing complex digital functions and custom fabrics.
  • Embedded Memory Approximately 46 Mbits of on-chip RAM for buffering, scratch storage, and large state machines.
  • I/O Capacity 696 user I/O pins to support dense external connectivity and multi-channel interfaces.
  • Power Core supply range of 820 mV to 880 mV to guide power delivery and thermal design.
  • Package & Mounting 1517-BBGA (1517-FBGA, 40×40) FCBGA surface-mount package for compact board-level integration.
  • Temperature & Grade Industrial grade device with an operating range of −40 °C to 100 °C and RoHS-compliant materials.
  • Stratix V Family Characteristics Electrical and switching characteristics, including available speed grades for Stratix V GS devices, are documented in the Stratix V device datasheet.

Unique Advantages

  • High integration density: ~583k logic elements allow consolidation of multiple functions into a single device, simplifying board design.
  • Substantial on-chip memory: Approximately 46 Mbits of embedded RAM reduces reliance on external memory for many buffering and state-storage needs.
  • Extensive I/O capability: 696 I/Os enable high channel counts and flexible interfacing without external multiplexing.
  • Industrial temperature rating: Specified operation from −40 °C to 100 °C supports deployment in thermally demanding environments.
  • Compact FCBGA package: 1517-BBGA (40×40) footprint supports dense PCB layouts while providing the connectivity required for complex systems.
  • Defined core supply window: 820–880 mV core supply simplifies power-supply design and verification for the FPGA core domain.

Why Choose 5SGSMD6K2F40I3N?

The 5SGSMD6K2F40I3N combines large programmable logic capacity, significant embedded memory, and a high I/O count in an industrial-grade Stratix V GS FPGA. These attributes make it suitable for designs that require dense logic integration, substantial on-chip buffering, and robust I/O capability within a compact FCBGA package.

Engineers and purchasers seeking a high-density, industrial-temperature FPGA with well-documented Stratix V family electrical and switching characteristics can leverage this device for scalable, high-function-count designs while aligning board-level power and thermal plans to the supplied specifications.

Request a quote or submit an inquiry for pricing and availability of the 5SGSMD6K2F40I3N to receive more information on lead times and ordering options.

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