5SGTMC5K3F40I2N

The 5SGTMC5K3F40I2N is a Stratix® V GT Field Programmable Gate Array (FPGA) in a 1517-BBGA (FCBGA) package designed for high-density programmable logic applications. It integrates 425,000 logic elements and approximately 46 Mbits of embedded memory to address complex digital designs that require substantial on-chip resources.

Built for industrial temperature operation and high I/O count, this device suits designs that demand robust logic capacity, extensive I/O connectivity (600 pins), and tight core-voltage control with a specified supply range of 870 mV to 930 mV.

Key Features

• High Logic Capacity — 425,000 logic elements provide large-scale programmable logic resources for complex functions and multi-module integration.
• Embedded Memory — Total on-chip RAM of 46,080,000 bits, or approximately 46 Mbits, for buffering, FIFOs, and embedded data storage.
• Extensive I/O — 600 user I/O pins support high-pin-count interfaces and dense board-level connectivity.
• Industrial Grade Operation — Specified operating temperature range from −40 °C to 100 °C for deployment in industrial environments.
• Power and Core Voltage — Core voltage supply range specified at 870 mV to 930 mV to support targeted power domains and design margins.
• Package and Mounting — 1517-BBGA FCBGA package (supplier package: 1517-FBGA, 40 × 40) with surface-mount mounting for compact, board-level integration.
• Standards Compliance — RoHS compliant, supporting lead-free manufacturing processes.

Typical Applications

• High-density digital systems — Implement large, integrated logic subsystems where on-chip resources and multiple I/O are required.
• Custom signal processing — Use embedded memory and extensive logic capacity for buffering, parallel processing, and custom datapaths.
• High-pin-count interface hubs — Leverage 600 I/Os to consolidate multiple board-level interfaces or to act as a central I/O manager.

Unique Advantages

• Substantial on-chip resources: 425,000 logic elements and approximately 46 Mbits of embedded memory reduce the need for external logic and memory components.
• High I/O density: 600 I/Os enable flexible interfacing and reduce the complexity of interconnect routing across the board.
• Industrial temperature rating: Operation from −40 °C to 100 °C makes the device suitable for demanding ambient conditions common in industrial deployments.
• Compact FCBGA package: The 1517-BBGA package provides a high-pin-count solution in a compact footprint for space-constrained designs.
• Controlled core supply range: Defined core voltage window (870 mV–930 mV) supports stable power management and predictable device behavior.
• RoHS compliance: Supports lead-free manufacturing and regulatory compliance for global production.

Why Choose 5SGTMC5K3F40I2N?

The 5SGTMC5K3F40I2N positions itself as a high-density Stratix V GT FPGA option where substantial logic capacity, generous on-chip memory, and a large I/O count are required. Its industrial temperature rating and controlled core-voltage specification make it suitable for robust, production-grade designs that must operate reliably across a wide thermal range.

This device is well suited to engineers building complex digital systems who need to consolidate functions on a single programmable die—reducing external component count while retaining flexibility for in-field reconfiguration. The combination of package density, resource counts, and regulatory compliance supports scalable designs and streamlined manufacturing.

Request a quote or submit an inquiry to obtain pricing and availability for the 5SGTMC5K3F40I2N and to discuss lead times and volume options.