5SGTMC7K2F40C1
| Part Description |
Stratix® V GT Field Programmable Gate Array (FPGA) IC 600 51200000 622000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 907 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 600 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 234750 | Number of Logic Elements/Cells | 622000 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGTMC7K2F40C1 – Stratix® V GT Field Programmable Gate Array (FPGA) IC
The 5SGTMC7K2F40C1 is a high-capacity Stratix® V GT FPGA in a 1517-BBGA (FCBGA) package, offering dense programmable logic and substantial on-chip memory for complex system designs. It provides 622,000 logic elements, approximately 51.2 Mbits of embedded RAM, and up to 600 GPIOs to support I/O‑intensive applications.
Designed for commercial-grade systems, this device operates from a core voltage range of 0.87 V to 0.93 V and across an operating temperature range of 0 °C to 85 °C, making it suitable for demanding prototyping, signal processing, and communications applications that require large programmable resources and extensive I/O connectivity.
Key Features
- Logic Capacity Provides 622,000 logic elements to implement large, complex logic functions and control structures.
- Embedded Memory Approximately 51.2 Mbits of on-chip RAM to support frame buffers, lookup tables, and data buffering without external memory.
- DSP Resources Includes 256 18×18 multipliers and 256 hardened single-precision floating-point multipliers/adders for high-throughput arithmetic and signal-processing tasks.
- Clocking and Timing On-chip clocking resources include 16 global clocks and 92 regional clocks, plus 28 PLLs to support flexible clock domain design.
- I/O and Connectivity Up to 600 GPIOs are available for device interfacing; datasheet indicates a maximum of 776 user I/O pins in platform documentation for broader I/O planning.
- Package & Mounting 1517-BBGA (1517-FBGA, 40×40) FCBGA package; surface-mount mounting type simplifies integration on high-density PCBs.
- Power Core supply voltage range specified at 0.87 V to 0.93 V for predictable power planning and rail design.
- Commercial Grade Specified operating temperature range of 0 °C to 85 °C for commercial applications.
- Large Register File Registers on-chip total 938,880 to support deep pipelining and state retention across complex designs.
Typical Applications
- High‑performance signal processing Leverage the device's large DSP resource set and extensive logic to implement real-time filtering, FFTs, and other compute-intensive algorithms.
- Communications and networking Use abundant logic, embedded RAM, and numerous I/Os for packet processing, interface bridging, and protocol offload functions.
- Advanced prototyping and SoC integration Ample logic and memory capacity make this FPGA suitable for system-level validation, hardware/software co-design, and complex IP integration.
- Video and imaging pipelines On-chip RAM and DSP multipliers support high-throughput image buffering and real-time processing pipelines.
Unique Advantages
- High logic density: 622,000 logic elements enable consolidation of large functional blocks and multi‑module systems on a single device.
- Substantial embedded memory: Approximately 51.2 Mbits of on-chip RAM reduces dependency on external memory and improves data-path latency.
- Rich DSP capability: Dedicated 18×18 multipliers and floating-point multiplier/adders accelerate arithmetic-intensive workloads.
- Comprehensive clocking: Multiple global and regional clocks plus 28 PLLs provide flexible clock-domain management for complex designs.
- Compact surface-mount FCBGA package: 1517-BBGA (40×40) footprint balances high pin-count routing with a compact board area.
- Predictable power and thermal envelope: Specified core voltage range and commercial temperature rating simplify system-level power and thermal planning.
Why Choose 5SGTMC7K2F40C1?
The 5SGTMC7K2F40C1 is positioned for designs that require large programmable logic capacity, extensive embedded memory, and substantial DSP resources within a compact FCBGA package. Its combination of 622,000 logic elements, approximately 51.2 Mbits of RAM, and dedicated arithmetic blocks supports demanding signal-processing, communications, and prototyping workloads.
Engineers seeking a commercially graded FPGA with a broad I/O footprint and configurable clocking resources will find this device suitable for consolidating complex functions, reducing external component count, and accelerating time-to-prototype while maintaining straightforward power and thermal constraints.
Request a quote or submit an inquiry for part number 5SGTMC7K2F40C1 to receive pricing, availability, and lead-time information for your next design.

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