5SGTMC7K2F40C1

The 5SGTMC7K2F40C1 is a high-capacity Stratix® V GT FPGA in a 1517-BBGA (FCBGA) package, offering dense programmable logic and substantial on-chip memory for complex system designs. It provides 622,000 logic elements, approximately 51.2 Mbits of embedded RAM, and up to 600 GPIOs to support I/O‑intensive applications.

Designed for commercial-grade systems, this device operates from a core voltage range of 0.87 V to 0.93 V and across an operating temperature range of 0 °C to 85 °C, making it suitable for demanding prototyping, signal processing, and communications applications that require large programmable resources and extensive I/O connectivity.

Key Features

• Logic Capacity  Provides 622,000 logic elements to implement large, complex logic functions and control structures.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support frame buffers, lookup tables, and data buffering without external memory.
• DSP Resources  Includes 256 18×18 multipliers and 256 hardened single-precision floating-point multipliers/adders for high-throughput arithmetic and signal-processing tasks.
• Clocking and Timing  On-chip clocking resources include 16 global clocks and 92 regional clocks, plus 28 PLLs to support flexible clock domain design.
• I/O and Connectivity  Up to 600 GPIOs are available for device interfacing; datasheet indicates a maximum of 776 user I/O pins in platform documentation for broader I/O planning.
• Package & Mounting  1517-BBGA (1517-FBGA, 40×40) FCBGA package; surface-mount mounting type simplifies integration on high-density PCBs.
• Power  Core supply voltage range specified at 0.87 V to 0.93 V for predictable power planning and rail design.
• Commercial Grade  Specified operating temperature range of 0 °C to 85 °C for commercial applications.
• Large Register File  Registers on-chip total 938,880 to support deep pipelining and state retention across complex designs.

Typical Applications

• High‑performance signal processing  Leverage the device's large DSP resource set and extensive logic to implement real-time filtering, FFTs, and other compute-intensive algorithms.
• Communications and networking  Use abundant logic, embedded RAM, and numerous I/Os for packet processing, interface bridging, and protocol offload functions.
• Advanced prototyping and SoC integration  Ample logic and memory capacity make this FPGA suitable for system-level validation, hardware/software co-design, and complex IP integration.
• Video and imaging pipelines  On-chip RAM and DSP multipliers support high-throughput image buffering and real-time processing pipelines.

Unique Advantages

• High logic density: 622,000 logic elements enable consolidation of large functional blocks and multi‑module systems on a single device.
• Substantial embedded memory: Approximately 51.2 Mbits of on-chip RAM reduces dependency on external memory and improves data-path latency.
• Rich DSP capability: Dedicated 18×18 multipliers and floating-point multiplier/adders accelerate arithmetic-intensive workloads.
• Comprehensive clocking: Multiple global and regional clocks plus 28 PLLs provide flexible clock-domain management for complex designs.
• Compact surface-mount FCBGA package: 1517-BBGA (40×40) footprint balances high pin-count routing with a compact board area.
• Predictable power and thermal envelope: Specified core voltage range and commercial temperature rating simplify system-level power and thermal planning.

Why Choose 5SGTMC7K2F40C1?

The 5SGTMC7K2F40C1 is positioned for designs that require large programmable logic capacity, extensive embedded memory, and substantial DSP resources within a compact FCBGA package. Its combination of 622,000 logic elements, approximately 51.2 Mbits of RAM, and dedicated arithmetic blocks supports demanding signal-processing, communications, and prototyping workloads.

Engineers seeking a commercially graded FPGA with a broad I/O footprint and configurable clocking resources will find this device suitable for consolidating complex functions, reducing external component count, and accelerating time-to-prototype while maintaining straightforward power and thermal constraints.

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