5SGTMC5K3F40I3N

The 5SGTMC5K3F40I3N is a Stratix V GT Field Programmable Gate Array (FPGA) IC from Intel, built for designs that require large programmable logic capacity, abundant embedded memory, and a high I/O count. As an industrial-grade device in a 1517-ball FCBGA package, it is specified for wide operating conditions and surface-mount assembly.

Key architectural attributes include 425,000 logic elements, approximately 46.08 Mbits of embedded RAM, and 600 user I/O pins—making this device suitable for dense logic implementations, complex system interfaces, and designs that must operate across a broad temperature range.

Key Features

• Core Logic Density  425,000 logic elements provide substantial programmable capacity for complex digital functions and deep logic integration.
• Embedded Memory  Approximately 46.08 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive processing without external SDRAM for many use cases.
• I/O Resources  600 user I/O pins enable wide parallel interfaces, high-pin-count connectivity, and flexible board-level routing.
• Package & Mounting  1517-BBGA (FCBGA) package, supplied as a 1517-FBGA (40×40) format, intended for surface-mount PCB assembly.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, suitable for industrial environments and extended-temperature applications.
• Low-Voltage Core Supply  Core voltage range specified at 820 mV to 880 mV for the device’s core power domain.
• Regulatory Compliance  RoHS-compliant manufacturing status for environmental compliance in standard production.

Typical Applications

• High-density digital processing  Implement large-scale custom logic, data-path pipelines, and protocol processing using the device’s 425,000 logic elements and abundant on-chip RAM.
• Multi-interface aggregation  Consolidate multiple parallel and serial interfaces on a single FPGA thanks to 600 user I/Os for bridging, protocol translation, and hub functions.
• Industrial control and instrumentation  Deploy in systems that require industrial temperature operation (−40 °C to 100 °C) and robust surface-mount packaging.
• Embedded memory–heavy designs  Use the device’s ~46.08 Mbits of embedded RAM to reduce external memory needs for buffering, look-up tables, and on-chip data storage.

Unique Advantages

• High logic capacity: 425,000 logic elements allow integration of complex functionality that would otherwise require multiple devices.
• Significant on-chip memory: Approximately 46.08 Mbits of embedded RAM reduces dependence on external memory components and simplifies board design.
• Extensive I/O capability: 600 user I/Os accommodate broad connectivity and high-channel-count interface requirements.
• Industrial-grade thermal range: Rated from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compact FCBGA packaging: 1517-ball FCBGA (40×40) format supports high-density PCB layouts while remaining compatible with surface-mount assembly flows.
• Low-voltage core operation: Core supply specified at 820–880 mV to align with low-voltage power domains commonly used in modern systems.

Why Choose 5SGTMC5K3F40I3N?

The 5SGTMC5K3F40I3N positions itself as a high-capacity, industrial-grade Stratix V GT FPGA option for engineers building complex digital systems that demand substantial logic resources, on-chip memory, and a high I/O count in a compact FCBGA package. Its electrical and switching characteristics are documented as part of the Stratix V device family, facilitating integration into designs that require detailed device-level specifications.

This device is suited to teams looking to consolidate functions onto a single programmable fabric—reducing component count and simplifying system architecture—while retaining the thermal range and packaging needed for industrial deployments.

If you need a quote or want to submit a procurement inquiry for 5SGTMC5K3F40I3N, request a quote or sales inquiry through your preferred procurement channel to initiate availability and pricing details.