5SGTMC5K3F40I3

IC FPGA 600 I/O 1517FBGA
Part Description

Stratix® V GT Field Programmable Gate Array (FPGA) IC 600 46080000 425000 1517-BBGA, FCBGA

Quantity 279 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs160500Number of Logic Elements/Cells425000
Number of GatesN/AECCNOBSOLETEHTS Code0000.00.0000
QualificationN/ATotal RAM Bits46080000

Overview of 5SGTMC5K3F40I3 – Stratix® V GT FPGA, 425,000 logic elements, 600 I/Os

The 5SGTMC5K3F40I3 is a high-capacity Field Programmable Gate Array (FPGA) designed for industrial applications. It combines large programmable fabric, abundant on-chip memory, and a rich set of clock and DSP resources to support complex digital designs and system integration.

Key architectural highlights include 425,000 logic elements, approximately 46 Mbits of embedded memory, and up to 600 general-purpose I/O pins in a 1517-BBGA FCBGA package. The device operates over an industrial temperature range and supports low-voltage core supply to align with modern system power budgets.

Key Features

  • Logic Capacity  425,000 logic elements and 641,600 registers provide substantial programmable resources for sizeable logic and control functions.
  • Embedded Memory  Approximately 46 Mbits of on-chip RAM for buffering, lookup tables, and state retention within the FPGA fabric.
  • DSP Resources  256 dedicated 18×18 multipliers to accelerate arithmetic, filtering, and signal-processing tasks.
  • Clocking and Timing  16 global clocks, 92 regional clocks and 28 PLLs enable flexible clock-domain partitioning and precise timing control across large designs.
  • I/O and SerDes-Friendly I/O  Up to 600 GPIOs and support for up to 150 LVDS channels provide high-density interfacing options for parallel and differential signaling.
  • Package and Mounting  Supplied in a 1517-BBGA (1517-FBGA, 40×40) FCBGA package for compact, high-pin-count surface-mount integration.
  • Power and Temperature  Core voltage range of 820 mV to 880 mV and industrial operating temperature from −40 °C to 100 °C for robust operation in demanding environments.
  • Compliance  RoHS compliant for regulatory and environmental considerations.

Unique Advantages

  • High logic density: 425,000 logic elements enable consolidation of complex functions onto a single device, reducing board-level component count.
  • Significant on-chip memory: Approximately 46 Mbits of embedded RAM supports data buffering and stateful processing without immediate reliance on external memory.
  • Strong DSP capability: 256 18×18 multipliers accelerate compute-intensive workloads such as filtering, transforms, and fixed-point math.
  • Flexible clock infrastructure: Multiple global and regional clocks plus 28 PLLs simplify multi-domain timing and clock distribution for large designs.
  • High I/O density: Up to 600 GPIOs and 150 LVDS channels offer extensive external interfacing for sensors, peripherals, and high-speed differential links.
  • Industrial-grade robustness: Wide operating temperature range (−40 °C to 100 °C) and RoHS compliance support deployment in industrial environments.

Why Choose 5SGTMC5K3F40I3?

The 5SGTMC5K3F40I3 positions itself for designs that require substantial programmable logic, embedded memory, and DSP acceleration in an industrial-grade FPGA. Its combination of high logic element count, dedicated multipliers, abundant clocking resources, and extensive I/O density makes it suitable for complex system integration where on-chip capacity and reliability matter.

This part is suited to engineering teams and procurement looking for a scalable, RoHS-compliant FPGA solution with a surface-mount FCBGA footprint and operating characteristics tailored to industrial applications. The device’s resource balance supports consolidation of multiple functions onto a single silicon platform, helping simplify BOM and board-level design.

Request a quote or submit an inquiry to receive pricing, lead-time, and availability information for part number 5SGTMC5K3F40I3.

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