5SGXEA4K2F40C2LN

The 5SGXEA4K2F40C2LN is a Stratix® V GX field-programmable gate array (FPGA) from Intel offered in a 1517-BBGA (FCBGA) package. It provides a high-density programmable logic platform with substantial embedded RAM and a large complement of I/O, targeted for commercial-temperature applications.

Designed for system integrators and embedded designers, this device delivers high gate density, extensive on-chip memory, and a wide set of I/O resources to support complex digital, signal-processing, and I/O-intensive designs.

Key Features

• Core Logic 420,000 logic elements for implementing large-scale digital functions and complex processing pipelines.
• Embedded Memory Approximately 38 Mbits of on-chip RAM to support buffering, FSMs, and data-path storage without external memory.
• I/O Density 696 general-purpose I/O pins to support extensive peripheral interfacing and multi-channel connectivity.
• Supply Voltage Core operating range from 820 mV to 880 mV for defined power and performance operating points.
• Package & Mounting 1517-ball BGA (FCBGA) package, supplier device package 1517-FBGA (40×40); surface-mount mounting for modern PCB assembly.
• Temperature & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C suited to standard commercial deployments.
• Compliance RoHS compliant to meet common environmental and material requirements.

Typical Applications

• High-density digital processing — Implement complex signal processing, custom compute engines, and large FPGA-based algorithms using extensive logic and embedded RAM.
• Multi-channel I/O systems — Use the broad I/O count to interface with many sensors, transceivers, or parallel peripherals in communications and instrumentation designs.
• Prototyping and system integration — Deploy as a development platform for advanced ASIC prototyping, system validation, and integration where configurable logic and memory are required.

Unique Advantages

• High logic density: 420,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level complexity.
• Substantial embedded memory: Approximately 38 Mbits of on-chip RAM reduces reliance on external memory for many buffering and scratchpad needs.
• Extensive I/O capacity: 696 I/O pins provide flexibility for dense connectivity and parallel interfaces, simplifying routing for multi-channel designs.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation to match typical commercial product environments.
• Industry-standard package: 1517-ball FCBGA surface-mount package supports modern PCB assembly processes and thermal management practices.
• RoHS compliant: Material compliance supports common regulatory and environmental requirements for commercial products.

Why Choose 5SGXEA4K2F40C2LN?

The 5SGXEA4K2F40C2LN combines a high count of logic elements, sizable embedded memory, and a large I/O complement in a single commercial-grade FCBGA package. It is positioned for designers who need to implement complex, I/O-rich digital systems while minimizing external components and board-level complexity.

Suitable for development and production in commercial environments, this Stratix V GX device offers the capacity and integration to support demanding FPGA designs with clear, verifiable specifications for power, temperature, and packaging.

Request a quote or submit an inquiry to obtain pricing, availability, and additional technical support for the 5SGXEA4K2F40C2LN.