5SGXEA4K2F40C2L

The Intel Stratix® V GX FPGA 5SGXEA4K2F40C2L is a commercial-grade, high-density programmable logic device delivered in a 1517-ball FCBGA package. It provides large-scale logic and on-chip memory resources with extensive I/O to support complex digital designs that require significant logic capacity and embedded RAM.

This device is purpose-built for applications that demand high logic density, substantial embedded memory, and a large number of I/O connections while operating within standard commercial temperature and supply ranges.

Key Features

• High Logic Capacity — Approximately 420,000 logic elements to implement large and complex digital designs.
• Logic Array Blocks — 158,500 logic array blocks (LABs) for structured logic partitioning and resource mapping.
• Embedded Memory — Approximately 37.9 Mbits of on-chip RAM for data buffering, FIFOs, and memory-intensive functions.
• Extensive I/O — 696 user I/O pins to support broad external connectivity and multi-channel interfacing.
• Package & Mounting — 1517-BBGA (FCBGA) package, supplier package listed as 1517-FBGA (40×40), designed for surface-mount PCB assembly.
• Power Requirements — Core voltage supply specified from 820 mV to 880 mV for device operation.
• Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C, suitable for commercial-environment deployments.
• Regulatory Compliance — RoHS compliant, meeting common environmental requirements for electronic assemblies.

Typical Applications

• High-density digital processing — Leverage ~420,000 logic elements and abundant embedded RAM to implement complex datapaths and custom processors.
• Multi-channel I/O aggregation — Use 696 I/O pins to consolidate and interface with multiple external devices, sensors, or buses.
• Memory-intensive algorithms — Utilize approximately 37.9 Mbits of on-chip RAM for buffering, packet staging, and algorithm state storage.

Unique Advantages

• Scalable logic resources: Large logic element count enables scaling of design complexity without multiple-device partitioning.
• Significant embedded memory: Near 38 Mbits of on-chip RAM reduces dependence on external memory for many common buffering and streaming tasks.
• Broad I/O capability: 696 I/O pins provide flexibility for high-connectivity designs and multi-interface implementations.
• Surface-mount FCBGA package: 1517-ball package supports high-density board designs and conventional SMT assembly processes.
• Commercial-grade operating range: Rated 0 °C to 85 °C and RoHS compliant for standard commercial product deployments.
• Defined core supply range: 820 mV–880 mV specification allows precise power-delivery planning and margining in system design.

Why Choose 5SGXEA4K2F40C2L?

The 5SGXEA4K2F40C2L Stratix V GX FPGA delivers a combination of high logic density, substantial embedded RAM, and expansive I/O in a compact 1517-ball FCBGA package. Its commercial temperature rating and RoHS compliance make it suitable for a wide range of commercial electronic systems that require on-chip memory and large-scale programmable logic.

Design teams targeting complex digital signal processing, multi-channel interfacing, or memory-heavy applications will find the device’s resource balance and package options valuable for consolidating functionality and simplifying board-level integration.

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