5SGXEA4K2F35I3N

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 37888000 420000 1152-BBGA, FCBGA

Quantity 480 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs158500Number of Logic Elements/Cells420000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits37888000

Overview of 5SGXEA4K2F35I3N – Stratix® V GX FPGA, 420,000 logic elements, 1152-BBGA

The 5SGXEA4K2F35I3N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel (Altera), offering a high-density programmable fabric suited for complex digital designs. This device provides 420,000 logic elements and approximately 37.9 Mbits of embedded memory, combined with 432 I/Os to support dense interfacing and integration in industrial systems.

Designed for surface-mount assembly in a 1152-BBGA (35×35) FCBGA package, the device operates from a core supply of 820 mV to 880 mV and is rated for industrial temperatures from −40 °C to 100 °C, enabling deployment in temperature-challenging environments.

Key Features

  • Core Logic 420,000 logic elements provide substantial programmable capacity for large FPGA designs and complex logic architectures.
  • Embedded Memory Approximately 37.9 Mbits of on-chip RAM for buffering, state storage, and memory-intensive functions.
  • I/O Density 432 available I/Os to support broad external interfacing and high pin-count system integration.
  • Power and Voltage Core supply operating range from 820 mV to 880 mV to match targeted power domains and platform requirements.
  • Package & Mounting 1152-BBGA FCBGA (supplier package: 1152-FBGA, 35×35) in a surface-mount format for compact board-level integration.
  • Industrial Temperature Grade Rated for −40 °C to 100 °C operation, supporting designs that require extended temperature range.
  • Environmental Compliance RoHS compliant for regulatory and environmental considerations.

Unique Advantages

  • High integration density: 420,000 logic elements and ~37.9 Mbits of embedded memory consolidate complex functions into a single FPGA, reducing external component count.
  • Broad I/O capacity: 432 I/Os enable multiple high-pin-count interfaces and flexible system connectivity options.
  • Industrial-ready thermal range: −40 °C to 100 °C rating supports reliable operation in temperature-challenging deployments.
  • Compact FCBGA packaging: 1152-BBGA (35×35) package delivers a dense board footprint for space-constrained applications.
  • Controlled core voltage: 820–880 mV supply range allows precision power-domain design and consistency with core voltage requirements.
  • Regulatory compliance: RoHS conformity supports environmental and manufacturing requirements.

Why Choose 5SGXEA4K2F35I3N?

The 5SGXEA4K2F35I3N positions itself for designs that require a high level of integration: large programmable logic capacity, substantial embedded memory, and a high I/O count in a compact surface-mount FCBGA package. Its industrial temperature rating and defined core supply range make it suitable for engineers targeting robust, high-density FPGA implementations.

This device is appropriate for teams needing scalable logic and memory resources with predictable electrical and thermal characteristics, backed by Intel’s Stratix V family documentation and specifications.

Request a quote or submit an inquiry to receive availability and pricing information for the 5SGXEA4K2F35I3N. Our team can provide lead-time and order support based on your project requirements.

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