5SGXEA4K2F35I3LG

The 5SGXEA4K2F35I3LG is a Stratix® V GX field programmable gate array (FPGA) IC provided in a 1152-ball BGA (FCBGA) package. It delivers a large logic fabric combined with substantial on-chip RAM and a high I/O count, and it is offered in an industrial temperature grade.

As a member of the Stratix V GX family, this device aligns with the family’s documented offerings for core and transceiver speed grades and is intended for designs requiring high logic density, abundant embedded memory, and broad I/O capability.

Key Features

• Core Logic  420,000 logic elements provide a large programmable fabric for complex digital designs.
• Embedded Memory  Approximately 37.9 Mbits of on-chip RAM for buffering, FIFOs, and implemented algorithms.
• I/O Capacity  432 general-purpose I/Os to support extensive peripheral, sensor, and interface connectivity.
• Package  1152-BBGA (FCBGA) supplier package: 1152-FBGA (35×35) for high-density board integration.
• Power Supply  Core voltage range specified from 820 mV to 880 mV to match regulated core power rails.
• Temperature and Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C.
• Mounting  Surface-mount device suitable for standard PCB assembly processes.
• Standards Compliance  RoHS compliant as indicated in the product data.

Typical Applications

• High-density signal processing  Leverage 420,000 logic elements and ~37.9 Mbits of embedded memory for complex data-paths and algorithm acceleration.
• Large I/O interface hubs  Use 432 I/Os to aggregate and manage multiple high-pin-count peripherals and sensors on a single FPGA.
• Industrial control and instrumentation  Industrial temperature rating (−40 °C to 100 °C) supports deployment in temperature-challenging environments.

Unique Advantages

• High logic density: 420,000 logic elements enable consolidation of large or multiple functions into one device, reducing system complexity.
• Substantial embedded RAM: Approximately 37.9 Mbits of on-chip memory minimizes external memory dependence for buffering and local storage.
• Extensive I/O headroom: 432 I/Os simplify board-level routing and peripheral integration for complex systems.
• Industrial-grade thermal range: −40 °C to 100 °C operation supports designs requiring robust temperature tolerance.
• Compact BGA package: 1152-ball FCBGA (35×35) balances high pin count with a compact PCB footprint for dense board layouts.
• Regulated core voltage support: Clear core supply window (820 mV–880 mV) helps align power-supply design with device requirements.
• RoHS compliant: Environmentally compliant manufacturing and supply chain considerations.

Why Choose 5SGXEA4K2F35I3LG?

The 5SGXEA4K2F35I3LG combines extensive logic resources, significant on-chip RAM, and a high I/O count in an industrial-grade Stratix V GX package. This combination makes it appropriate for designs that require integration of large digital functions, substantial buffering or algorithmic memory, and broad external connectivity while meeting extended temperature requirements.

As part of the Stratix V GX family, the device benefits from the documented family-level options for core and transceiver speed grades, providing design teams with a clear upgrade path and the support of established device documentation and specifications.

Request a quote or submit an inquiry to receive pricing and availability for the 5SGXEA4K2F35I3LG and to discuss how it can fit your next high-density FPGA design.