5SGXEA4K2F35I2LN

The 5SGXEA4K2F35I2LN is a Stratix® V GX field programmable gate array (FPGA) optimized for high‑density, high‑performance system designs. It combines large logic and embedded memory resources with a full complement of I/O and high‑speed transceiver capability offered across the Stratix V GX family.

Designed for industrial environments, this device delivers a broad operating temperature range and a compact 1152‑FBGA (35×35) package suitable for surface‑mount board assemblies. Typical use cases include high‑bandwidth communications, advanced signal processing, and compute‑intensive FPGA applications that require extensive on‑chip resources and flexible I/O.

Key Features

• Core and Logic  Approximately 420,000 logic element cells and 158,500 logic blocks provide ample programmable fabric for complex designs and deep parallelism.
• Embedded Memory  Approximately 37.9 Mbits of on‑chip RAM for buffering, packet processing, and data staging within the FPGA fabric.
• I/O and Connectivity  432 device I/O pins enabling wide peripheral connectivity and system interfacing. As a Stratix V GX family device, GX transceiver options are available across speed grades (family datasheet lists GX channel capability up to 14.1 Gbps depending on speed grade).
• Power and Voltage  Core supply range specified at 820 mV to 880 mV for the device core.
• Package and Mounting  1152‑FBGA (35×35) package case (listed as 1152‑BBGA, FCBGA) with surface‑mount compatibility for standard PCB assembly processes.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, suitable for industrial applications requiring extended temperature range.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High‑Speed Communications  FPGA fabric and GX transceiver family options support implementation of networking, backplane, and optical interface functions requiring multi‑Gbps links.
• Data Center & Acceleration  Large logic capacity and substantial embedded memory make this device well suited for packet processing, protocol offload, and hardware acceleration tasks.
• Signal Processing  Extensive logic and RAM resources support high‑throughput DSP pipelines and real‑time processing for communications and instrumentation.

Unique Advantages

• High Logic Density: Enables complex, highly parallel designs without immediate need for external logic expansion.
• Significant On‑Chip Memory: Approximately 37.9 Mbits of embedded RAM reduces dependence on external memory for buffering and staging, simplifying board design.
• Extensive I/O Count: 432 I/O pins provide flexible interfacing options to peripherals, transceivers, and system buses.
• Industrial Temperature Range: −40 °C to 100 °C rating supports deployment in harsher operating environments where extended thermal range is required.
• Compact High‑Pin Package: 1152‑FBGA (35×35) delivers high pin density in a compact footprint for space‑constrained PCBs.
• Controlled Core Voltage: Defined core supply window (820–880 mV) aids in predictable power design and thermal budgeting.

Why Choose 5SGXEA4K2F35I2LN?

The 5SGXEA4K2F35I2LN positions itself as a high‑capacity Stratix V GX FPGA for engineers who need a balance of large programmable logic, substantial embedded memory, and robust I/O in an industrial‑rated device. Its package and thermal rating suit demanding boards where density and reliability are key.

This device is appropriate for teams implementing high‑bandwidth communications, compute acceleration, or advanced signal processing functions that benefit from on‑chip resources and family‑level transceiver capabilities. The combination of logic density, on‑chip RAM, and I/O flexibility delivers a scalable, durable building block for long‑running production designs.

Request a quote or submit an inquiry to receive pricing and availability for the 5SGXEA4K2F35I2LN and to discuss how this Stratix V GX FPGA can fit into your next design.