5SGXEA4K2F35I3G

The 5SGXEA4K2F35I3G is a Stratix V GX family FPGA from Intel, offered in an industrial temperature grade. It delivers high logic density and on-chip embedded memory in a compact ball grid array package for surface-mount board designs.

As a Stratix V GX device, this part is part of the Stratix V series device family and is described in Intel's Stratix V device datasheet, which documents device operating characteristics and series-level transceiver speed grade options.

Key Features

• High Logic Density  Approximately 420,000 logic elements to implement complex programmable logic and custom hardware functions.
• Embedded Memory  Approximately 38 Mbits of on-chip RAM for large buffering, lookup tables, and state storage.
• I/O Capacity  432 user I/O pins to support wide parallel interfaces and mixed-signal board-level connectivity.
• Power  Core voltage supply range of 820 mV to 880 mV to match Stratix V core power domains.
• Package & Mounting  1152-BBGA, FCBGA package; supplier device package listed as 1152-FBGA (35x35). Mounting type: surface mount.
• Temperature & Grade  Industrial grade device rated for operation from –40 °C to 100 °C.
• Standards & Compliance  RoHS compliant.
• Series-Level Transceiver Capability  Part of the Stratix V GX family, which the device datasheet describes as offering defined transceiver speed grades for high-speed serial links at the series level.

Typical Applications

• High-density programmable logic implementations  Use the ~420,000 logic elements and ~38 Mbits of embedded RAM for complex digital processing, control, and protocol handling.
• High-pin-count I/O systems  Leverage 432 I/O pins for systems that require numerous external interfaces or wide parallel buses.
• Industrial systems  Designed for industrial temperature operation (–40 °C to 100 °C) where extended temperature range and reliability are required.
• Surface-mount, compact boards  1152-BBGA/1152-FBGA package supports dense, surface-mount board layouts.

Unique Advantages

• High integration: Combines hundreds of thousands of logic elements with tens of megabits of embedded RAM to reduce external component count.
• Large I/O resource: 432 available I/O pins simplify interfacing to large peripherals, memory buses, and I/O-rich subsystems.
• Industrial-rated operation: Specified for –40 °C to 100 °C operation to meet demanding environmental requirements.
• Compact surface-mount package: 1152-BBGA / 1152-FBGA packaging enables dense PCB implementations while maintaining high pin count.
• Defined power envelope: Core supply range of 820 mV to 880 mV enables predictable power planning for system-level design.
• Series-level documentation: Backed by the Stratix V device datasheet that documents electrical characteristics, operating conditions, and series transceiver grade options.

Why Choose 5SGXEA4K2F35I3G?

This Stratix V GX FPGA part provides a combination of high logic density, substantial on-chip memory, and a large I/O complement in a surface-mount BGA package, targeted at industrial-grade applications. It is suitable for designs that require significant programmable logic resources, abundant embedded RAM, and a robust operating temperature range.

As a member of the Stratix V device family, the 5SGXEA4K2F35I3G benefits from series-level device documentation and defined transceiver grading in the Stratix V datasheet, supporting informed system design and long-term deployment planning.

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