5SGXEA4K2F35I3L
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 37888000 420000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 1,250 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 432 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 158500 | Number of Logic Elements/Cells | 420000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 37888000 |
Overview of 5SGXEA4K2F35I3L – Stratix V GX FPGA, 420,000 logic elements, 432 I/O, 1152-BBGA
The 5SGXEA4K2F35I3L is an industrial-grade Stratix® V GX field programmable gate array (FPGA) in a 1152-ball BGA FCBGA package. It delivers a high-density programmable fabric with a large logic capacity and substantial on-chip memory for advanced digital designs.
Designed for applications that require high integration and robust operating conditions, this device combines a core programmable architecture with transceiver-capable family attributes and industrial temperature range for deployment in demanding environments.
Key Features
- Logic Capacity — 420,000 logic elements suitable for complex combinational and sequential logic implementations.
- Embedded Memory — Approximately 37.9 Mbits of total on-chip RAM to support buffering, FIFOs, and local data storage.
- I/O Resources — 432 user I/O pins to interface with a wide range of peripherals and high-bandwidth buses.
- Package and Mounting — 1152-BBGA FCBGA package (supplier package: 1152-FBGA, 35 × 35 mm) with surface-mount mounting for compact board integration.
- Power and Core Supply — Core voltage supply range of 820 mV to 880 mV for defined power-domain integration.
- Temperature and Grade — Industrial grade with an operating temperature range from −40 °C to 100 °C for extended-environment reliability.
Typical Applications
- High-speed communications — Suitable for systems that leverage the Stratix V GX family’s transceiver-capable architecture for high-throughput serial interfaces and protocol bridging.
- Signal processing and compute acceleration — Large logic capacity and embedded RAM enable implementation of DSP pipelines, packet processing, and custom accelerators.
- Industrial control and automation — Industrial temperature rating and robust I/O count support control systems, motor drives, and sensor aggregation in harsh environments.
Unique Advantages
- High-density programmable fabric: 420,000 logic elements provide the headroom to implement large, complex designs without external glue logic.
- Significant on-chip memory: Approximately 37.9 Mbits of embedded RAM reduces dependence on external memory for buffering and intermediate storage.
- Flexible I/O connectivity: 432 I/O pins allow broad peripheral interfacing and multiple parallel/high-speed bus connections.
- Industrial-grade operation: Rated for −40 °C to 100 °C, enabling deployment in temperature-sensitive and industrial environments.
- Compact BGA footprint: 1152-ball FCBGA package (35 × 35 mm supplier footprint) balances pin density with a manageable board area for system-level integration.
- Defined core supply window: 0.82–0.88 V core supply simplifies power-domain planning for high-performance FPGA deployments.
Why Choose 5SGXEA4K2F35I3L?
The 5SGXEA4K2F35I3L positions itself as a high-density, industrial-grade FPGA option within the Stratix V GX family. Its combination of 420,000 logic elements, approximately 37.9 Mbits of embedded memory, and 432 I/O make it well suited to complex digital signal processing, high-speed communications, and industrial control systems that require substantial on-chip resources and robust environmental tolerance.
For designs that need scalability and integration without compromising operating range, this device offers a verifiable specification set and a compact BGA package suitable for production-grade boards and systems engineering workflows.
If you would like pricing, availability, or a formal quote for the 5SGXEA4K2F35I3L, submit a request and our team will respond with the information you need to move your design forward.

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