5SGXEA4K2F35I2N

The 5SGXEA4K2F35I2N is a Stratix® V GX field programmable gate array (FPGA) IC from Intel, offered in a 1152‑ball FCBGA package. It provides a high logic capacity device class with substantial on‑chip memory and a large I/O count targeted at demanding industrial designs.

Key technical characteristics visible from the device data include approximately 420,000 logic elements, approximately 37.9 Mbits of embedded memory, 432 general I/Os, an industrial operating temperature range, and a low-voltage supply window—attributes that enable dense digital implementations and robust operation across extended temperature ranges.

Key Features

• Core logic  Approximately 420,000 logic elements for high‑density digital integration and complex logic implementations.
• On‑chip memory  Approximately 37.9 Mbits of embedded memory to support large buffers, state machines, and local data storage.
• I/O capacity  432 I/O pins to support wide parallel interfaces, multiple peripherals, or multi‑lane external connectivity.
• Power  Specified voltage supply range of 870 mV to 930 mV, enabling operation within a precise core supply window.
• Package & mounting  1152‑BBGA (FCBGA) package, supplier device package 1152‑FBGA (35×35), surface‑mount mounting for compact board integration.
• Industrial temperature  Rated for operation from −40 °C to 100 °C, suitable for industrial ambient conditions.
• Regulatory status  RoHS‑compliant.

Typical Applications

• High‑density digital processing  Use the large logic element count and embedded memory to implement complex pipelines, accelerators, and algorithmic state machines.
• Industrial control and automation  Industrial temperature rating and robust I/O count make the device suitable for factory automation, motion control, and PLC interfaces.
• High‑pin‑count interface hubs  Leverage 432 I/Os for multi‑lane parallel interfaces, aggregation of sensors/actuators, or wide bus bridging tasks.

Unique Advantages

• High logic capacity: Approximately 420,000 logic elements enable integration of large digital subsystems on a single device, reducing board‑level component count.
• Significant on‑chip memory: Roughly 37.9 Mbits of embedded RAM supports deep buffering and local data storage without external memory dependency.
• Large I/O resource: 432 I/Os provide flexibility to connect multiple peripherals and parallel interfaces directly to the FPGA fabric.
• Industrial reliability: Rated for −40 °C to 100 °C operation for deployment in industrial environments that require extended temperature tolerance.
• Compact FCBGA packaging: 1152‑ball FCBGA (35×35) offers a high‑density package option for space‑constrained designs while maintaining a large pin count.
• Regulatory compliance: RoHS‑compliant to meet modern electronic manufacturing requirements.

Why Choose 5SGXEA4K2F35I2N?

The 5SGXEA4K2F35I2N positions itself as a high‑density, industrial‑grade Stratix V GX FPGA suitable for designs that require substantial logic capacity, on‑chip memory, and a large number of I/Os in a compact FCBGA package. Its operating temperature range and RoHS compliance make it appropriate for industrial system integration where reliability and regulatory alignment matter.

Designed within the Stratix V family and documented in Intel's device datasheet, this part is appropriate for engineering teams seeking a scalable FPGA building block for complex digital systems, industrial controls, and high‑pin‑count interface applications.

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