5SGXEA4K2F35I2G

The 5SGXEA4K2F35I2G is a Stratix V GX Field Programmable Gate Array from Intel, offering high-density programmable logic and extensive I/O in an FCBGA package. It combines a large logic fabric with substantial on-chip memory and industrial temperature capability for demanding embedded and communications applications.

Key architectural highlights include approximately 420,000 logic elements, roughly 38 Mbits of embedded memory, and 432 I/O pins, enabling complex system integration and high-speed interfacing in a single device.

Key Features

• Logic Capacity  Approximately 420,000 logic elements to implement large-scale digital designs and complex custom logic.
• Embedded Memory  Approximately 38 Mbits of on-chip RAM for large buffers, state machines, and data-path storage.
• I/O Resources  432 I/O pins to support broad peripheral and system interfacing requirements.
• High-speed Transceivers (series datasheet)  Stratix V GX devices in the series support GX channel transceiver speeds up to 14.1 Gbps depending on speed grade, per the device family datasheet.
• Power Supply  Specified core supply range from 870 mV to 930 mV for the device core.
• Package & Mounting  1152-BBGA, FCBGA package; supplier device package listed as 1152-FBGA (35×35). Surface-mount mounting type.
• Temperature & Grade  Industrial-grade device specified for operation from −40 °C to 100 °C.
• Regulatory  RoHS compliant.

Unique Advantages

• High logic density: The large pool of approximately 420,000 logic elements supports complex FPGA designs and multi-function systems without external PLD offload.
• Substantial on-chip RAM: Approximately 38 Mbits of embedded memory reduces dependence on external memory for many buffering and data-path tasks.
• Extensive I/O and high-speed capability: 432 I/Os plus GX-series transceiver support (up to 14.1 Gbps per family datasheet) facilitate high-bandwidth interfaces and system connectivity.
• Industrial temperature range: Specified operation from −40 °C to 100 °C provides suitability for environments requiring extended temperature tolerance.
• Compact FCBGA footprint: 1152-ball BGA (35×35 supplier package) delivers high integration density for space-constrained board designs.
• Supply and compliance: Core voltage defined between 870 mV and 930 mV with RoHS compliance for regulatory alignment.

Why Choose 5SGXEA4K2F35I2G?

5SGXEA4K2F35I2G positions itself as a high-capacity Stratix V GX FPGA option for engineers who need a dense logic fabric, large embedded memory, and broad I/O in an industrial-grade device. The combination of approximately 420,000 logic elements, roughly 38 Mbits of on-chip RAM, 432 I/Os, and support for high-speed GX transceivers (per series datasheet) makes it suitable for complex data processing, protocol bridging, and high-throughput interface designs.

Its 1152-ball FCBGA package and defined core voltage range deliver a compact, specification-driven solution for system integrators and product teams focused on scalable, robust programmable logic subsystems backed by Intel’s Stratix V family documentation.

Request a quote or submit an inquiry for 5SGXEA4K2F35I2G to evaluate this Stratix V GX FPGA for your next design.