5SGXEA4K2F35C3G

The 5SGXEA4K2F35C3G is a Stratix V GX family Field Programmable Gate Array (FPGA) IC designed for high-density programmable logic implementations. It combines a large logic fabric with substantial on-chip RAM and a high I/O count in a compact BGA package.

With 420,000 logic elements, approximately 37.888 Mbits of embedded memory, and 432 general-purpose I/Os, this commercial-grade device targets designs that require extensive programmable logic, significant embedded storage, and dense external connectivity while operating within a core supply window of 820 mV to 880 mV.

Key Features

• Core Logic Capacity  420,000 logic elements provide a large programmable fabric for complex digital designs and system integration.
• Embedded Memory  Approximately 37.888 Mbits of on-chip RAM for buffering, state storage, and data-path implementation without relying on external memory.
• I/O Resources  432 I/Os support extensive external interfacing and system-level connectivity in a single device.
• Power Supply  Core voltage specified between 820 mV and 880 mV to match system power-rail design requirements.
• Package & Mounting  1152-BBGA (FCBGA) supplier device package: 1152-FBGA (35×35); surface-mount construction suitable for board-level assembly.
• Grade & Temperature  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Regulatory  RoHS compliant.

Typical Applications

• High-density programmable logic systems  Implement large-scale digital functions and system-on-chip prototypes using the device’s extensive logic resources.
• Memory-intensive designs  On-chip RAM capacity supports buffering, packet staging, and other embedded storage needs without immediate dependence on external memory.
• I/O-dense system integration  High I/O count simplifies board design by minimizing the need for external I/O expansion when interfacing multiple peripherals or daughter cards.
• Commercial embedded platforms  Commercial temperature rating and surface-mount BGA package suit a range of commercial embedded applications and development systems.

Unique Advantages

• High integration density: 420,000 logic elements and substantial embedded RAM reduce the number of discrete components and simplify BOMs for complex designs.
• Reduced external memory requirements: Approximately 37.888 Mbits of on-chip RAM enables larger internal buffers and data structures on-chip, improving system compactness.
• Extensive I/O availability: 432 I/Os provide flexible connectivity for multi-channel interfaces and rich peripheral support without additional I/O chips.
• Compact, manufacturable package: 1152-BBGA (35×35) surface-mount package supports dense board layouts while maintaining practical assembly compatibility.
• Commercial temperature and RoHS compliance: Designed for commercial temperature operation (0 °C to 85 °C) and RoHS-compliant manufacturing requirements.
• Well-documented device family: Part of the Stratix V GX family with Intel-provided documentation for device characteristics and electrical guidelines.

Why Choose 5SGXEA4K2F35C3G?

The 5SGXEA4K2F35C3G positions itself as a high-capacity, commercially graded Stratix V GX FPGA optimized for designs that demand significant programmable logic, on-chip memory, and an extensive I/O complement in a compact BGA package. Its combination of 420,000 logic elements, approximately 37.888 Mbits of embedded RAM, and 432 I/Os makes it suitable for complex system integration where consolidation of functionality and board-level density are priorities.

Customers seeking a robust, well-documented FPGA from the Stratix V family will find this device appropriate for commercial embedded platforms, high-density logic implementations, and applications that require substantial on-chip resources while operating within standard commercial temperature and core-voltage ranges.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the 5SGXEA4K2F35C3G. Our team will respond with the details you need to move your design forward.