5SGXEA4K2F35C2L

The 5SGXEA4K2F35C2L is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel. It delivers large programmable logic capacity and substantial on‑chip memory in a high pin‑count BGA package for commercial‑grade designs.

This device is suited for designs that require extensive logic resources, significant embedded RAM, and a large number of I/O signals while operating within a commercial temperature range and a low‑voltage core supply.

Key Features

• Logic Capacity  Approximately 420,000 logic elements to implement complex programmable logic and custom processing functions.
• Embedded Memory  Approximately 37.9 Mbits of on‑chip RAM for buffering, state storage, and memory‑intensive functions.
• I/O Resources  432 user I/O pins to support dense connectivity and multi‑interface designs.
• Package  1152‑BBGA (FCBGA) package; supplier device package 1152‑FBGA (35×35) for high pin‑count, surface‑mount board integration.
• Power  Core voltage supply range of 820 mV to 880 mV.
• Temperature Grade  Commercial operating temperature range of 0 °C to 85 °C.
• Mounting  Surface mount package for standard PCB assembly processes.
• Compliance  RoHS compliant.

Typical Applications

• Logic‑intensive designs  Implement large custom logic blocks and complex state machines using the device's high logic element count.
• On‑chip buffering and memory  Leverage approximately 37.9 Mbits of embedded RAM for packet buffering, FIFOs, and local data storage.
• High‑pin‑count connectivity  Use the 432 I/Os for multi‑channel interfaces and dense board‑level interconnect requirements.
• Commercial embedded systems  Deploy in applications that operate within a 0 °C to 85 °C commercial temperature window and require surface‑mount integration.

Unique Advantages

• Highly scalable logic capacity: 420,000 logic elements enable implementation of large and complex designs without partitioning across multiple devices.
• Substantial on‑chip RAM: Approximately 37.9 Mbits of embedded memory reduces the need for external memory in many buffering and stateful applications.
• Extensive I/O count: 432 user I/Os provide flexibility for multi‑lane interfaces, parallel buses, and multiple peripheral connections.
• Compact high‑pin package: 1152‑BBGA (35×35) package delivers high pin density in a surface‑mount form factor suited for space‑constrained boards.
• Commercial‑grade operation: Rated for 0 °C to 85 °C to match standard commercial deployment environments.
• RoHS compliant: Supports lead‑free manufacturing requirements.

Why Choose 5SGXEA4K2F35C2L?

The 5SGXEA4K2F35C2L integrates a large logic fabric, significant embedded RAM, and a high I/O count in a single Stratix V GX FPGA package from Intel, making it appropriate for designs that consolidate functionality onto one device. Its commercial temperature rating and surface‑mount BGA package suit standard production and assembly processes.

Choose this part when your design requires substantial programmable logic and on‑chip memory with dense connectivity in a commercially rated FPGA solution.

Request a quote or submit a request for pricing and availability to move your design forward with the 5SGXEA4K2F35C2L.