5SGXEA4K2F35C1N

The 5SGXEA4K2F35C1N is a Stratix V GX Field Programmable Gate Array (FPGA) IC designed for high-density, reconfigurable logic applications. It integrates 420,000 logic elements and approximately 38 Mbits of embedded memory to support complex logic functions and on-chip data storage.

With 432 user I/O pins, a compact 1152-BBGA (35×35 1152-FBGA supplier package) footprint, and commercial operating grade (0 °C to 85 °C), this surface-mount device is suited to demanding FPGA-based designs where logic capacity, on-chip memory, and a dense I/O count are primary requirements.

Key Features

• Core Logic  420,000 logic elements for implementing large-scale, reconfigurable digital designs and custom logic blocks.
• Embedded Memory  Approximately 38 Mbits of on-chip RAM to support buffering, lookup tables, and state storage without external memory.
• I/O Density  432 I/O pins to interface with a broad range of peripherals, mezzanine cards, and board-level signals.
• Package & Mounting  1152-BBGA, FCBGA package (supplier device package: 1152-FBGA 35×35) in a surface-mount form factor for high-density PCB layouts.
• Power Supply  Core voltage range of 870 mV to 930 mV, allowing precise power provisioning for the FPGA core.
• Operating Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C for general-purpose and industrial-adjacent applications.
• Standards Compliance  RoHS compliant, meeting common environmental and material requirements.

Typical Applications

• High-density FPGA systems  Use the large logic element count and embedded memory to implement complex signal processing pipelines and algorithm accelerators on a single device.
• Interface aggregation  Leverage 432 I/O to consolidate multiple board-level interfaces and custom peripheral connections into a single programmable device.
• On-chip data buffering  Embedded memory provides local storage for data staging, FIFO buffering, and state machines without immediate dependency on external memory.

Unique Advantages

• Substantial logic capacity: 420,000 logic elements enable implementation of large, differentiated designs while reducing the need for multiple devices.
• Significant embedded memory: Approximately 38 Mbits of on-chip RAM reduces external memory requirements and simplifies board-level design.
• High I/O count: 432 user I/O pins support dense connectivity for complex board architectures and multi-channel interfaces.
• Compact, manufacturable package: 1152-BBGA (1152-FBGA supplier package) surface-mount footprint supports high-density PCB layouts and modern assembly processes.
• Commercial operating range: Rated for 0 °C to 85 °C to meet the needs of general-purpose electronic products and systems.
• Regulatory readiness: RoHS compliance supports environmentally conscious designs and regulatory requirements.

Why Choose 5SGXEA4K2F35C1N?

The 5SGXEA4K2F35C1N balances high logic capacity, substantial on-chip memory, and a dense I/O complement in a single Stratix V GX FPGA package. It is positioned for designs that require large-scale, reconfigurable logic, significant embedded storage, and flexible board-level connectivity while operating within a commercial temperature range.

For teams focused on consolidating functionality, reducing external component count, and accelerating time-to-market with a programmable platform, this device provides a measurable combination of resources and package density backed by Stratix V family documentation.

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