5SGXEA4K2F35C2LG

The 5SGXEA4K2F35C2LG is a Stratix V GX high-density FPGA from Intel, supplied in a 1152-ball FCBGA package. It delivers extensive programmable logic, embedded memory, and I/O resources for designs that require large on-chip capacity and high integration.

Key attributes include 420,000 logic elements, approximately 37.9 Mbits of embedded memory, and 432 user I/O pins. The device is commercial grade (0 °C to 85 °C), RoHS compliant, and optimized for surface-mount PCB assembly in a 35 × 35 mm FBGA package.

Key Features

• Core Logic  420,000 logic elements provide a high-density programmable fabric suitable for complex logic and system integration.
• Logic Array Blocks (LABs)  158,500 LABs reported in device data for fine-grained logic partitioning and resource planning.
• Embedded Memory  Approximately 37.9 Mbits of on-chip RAM to support large buffers, FIFOs, and memory-mapped logic functions.
• I/O Count  432 user I/O pins to support wide parallel interfaces and diverse peripheral connectivity.
• Power Supply  Core voltage specified between 820 mV and 880 mV to match system power-rail design and budgeting.
• Package & Mounting  1152-ball BBGA/FCBGA package; supplier device package listed as 1152-FBGA (35×35). Designed for surface-mount assembly.
• Operating Range & Grade  Commercial grade operation from 0 °C to 85 °C for standard temperature environments.
• Standards & Compliance  RoHS compliant to meet environmental and regulatory requirements for lead-free designs.
• Family-Level Capabilities  Part of the Stratix V GX family; device datasheet describes electrical characteristics, switching behavior, and transceiver speed-grade options for the Stratix V series.

Typical Applications

• High-density logic systems  Deploy large amounts of programmable logic and on-chip RAM where integration and programmable throughput are required.
• Data-path and buffering  Use the device’s embedded memory to implement buffers, FIFOs, and packet-handling structures in data-centric designs.
• Interface aggregation  Leverage 432 I/O pins to consolidate multiple parallel interfaces or to implement wide bus connections between system components.

Unique Advantages

• Substantial programmable capacity: 420,000 logic elements enable large-scale logic implementations without immediate escalation to multi-FPGA solutions.
• Significant embedded memory: Approximately 37.9 Mbits of on-chip RAM reduces external memory dependencies and simplifies board-level designs.
• High I/O density: 432 user I/O pins provide flexibility for parallel interfaces, peripherals, and system expansion.
• Compact, manufacturable package: 1152-ball FCBGA (35×35) format supports surface-mount assembly and dense PCB layouts.
• Commercial-temperature qualification: Specified for 0 °C to 85 °C operation to match a wide range of standard electronic systems.
• Regulatory readiness: RoHS compliance helps meet environmental packaging and supply-chain requirements.

Why Choose 5SGXEA4K2F35C2LG?

This Intel Stratix V GX FPGA balances high programmable logic capacity, large embedded memory, and a substantial I/O complement in a single commercial-grade FCBGA package. It is appropriate for designs that require integration of complex logic, wide I/O interfaces, and sizable on-chip buffering without moving to multi-chip architectures.

With clear device-level specifications for core voltage, package, and operating temperature, the 5SGXEA4K2F35C2LG is suited to engineering teams and procurement looking for a high-density, RoHS-compliant FPGA solution backed by Intel’s Stratix V device documentation and ecosystem.

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