5SGXEA4K2F35C3N

The 5SGXEA4K2F35C3N is an Intel Stratix® V GX field programmable gate array (FPGA) in a 1152-BBGA FCBGA package. It integrates high logic capacity, abundant I/O, and substantial on-chip RAM to support complex, high-density digital designs.

Designed for commercial-grade applications, this Stratix V GX device targets designs that require large programmable logic resources, a high I/O count, and significant embedded memory while operating within a 0 °C to 85 °C temperature range and a core supply window of 820 mV to 880 mV.

Key Features

• Programmable Logic Capacity 420,000 logic elements provide extensive resources for implementing large-scale digital functions and complex IP.
• Embedded Memory Approximately 38 Mbits of on-chip RAM for buffering, FIFOs, and local storage to support data-intensive processing.
• I/O Density 432 dedicated I/O pins to accommodate wide parallel interfaces and board-level connectivity.
• Power and Core Supply Operates with a core voltage range of 820 mV to 880 mV to match system power domains and enable predictable supply design.
• Package and Mounting 1152-BBGA FCBGA (supplier device package: 1152-FBGA, 35×35) for compact, high-density board integration; surface-mount mounting type.
• Commercial Grade Rated for commercial temperature operation from 0 °C to 85 °C.
• RoHS Compliant Conforms to RoHS requirements for environmental compliance.

Typical Applications

• High-density logic systems: Implement large, complex digital designs that require substantial logic element counts and on-chip memory.
• Networking and communications: Use the 432 I/Os and embedded memory to support board-level interfaces and packet buffering in communication equipment.
• Hardware acceleration and compute offload: Leverage the large logic and RAM resources for custom acceleration blocks and data-path implementations.
• System prototyping and integration: Consolidate multiple functions into a single FPGA to reduce component count and accelerate development cycles.

Unique Advantages

• High logic density: 420,000 logic elements enable consolidation of complex logic and IP into a single device, reducing system BOM and board area.
• Significant on‑chip memory: Approximately 38 Mbits of embedded RAM supports local buffering and lowers reliance on external memory.
• Large I/O complement: 432 I/Os provide flexibility for parallel interfaces, wide buses, and multiple peripheral connections.
• Compact, production-ready package: 1152-BBGA FCBGA packaging and surface-mount mounting support dense, manufacturable board designs.
• Commercial temperature rating: Specified operation from 0 °C to 85 °C for typical commercial deployments.
• Regulatory compliance: RoHS compliance simplifies environmental qualification and procurement.

Why Choose 5SGXEA4K2F35C3N?

The 5SGXEA4K2F35C3N combines a large programmable fabric with substantial on-chip RAM and a high I/O count in a compact 1152-BBGA package. Its commercial temperature rating and controlled core voltage range make it suitable for high-density commercial designs that require deterministic power domains and significant local memory.

This Stratix V GX device is well suited to customers building complex digital systems who need to scale logic and memory resources within a single FPGA, simplify board-level integration, and maintain compliance with RoHS requirements.

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