5SGXEA4K2F35I2L

The 5SGXEA4K2F35I2L is a Stratix V GX FPGA IC offering very large programmable logic capacity and embedded memory for integration-intensive designs. This industrial-grade device provides high I/O density and a compact FCBGA package for space-constrained, performance-sensitive applications.

Designed for applications that require substantial logic resources and on-chip RAM, the device delivers a combination of logic capacity, I/O count, and industrial temperature operation to support demanding embedded and communications designs.

Key Features

• Logic Capacity  Provides 420,000 logic elements for complex digital designs and high-density FPGA implementations.
• Embedded Memory  Includes approximately 37.9 Mbits of on-chip RAM to support large buffers, FIFOs, and memory-intensive algorithms.
• I/O Density  432 device I/O pins to support wide external interfaces and multi-channel connectivity.
• Package  Supplied in a 1152-BBGA (FCBGA) package; supplier device package listed as 1152-FBGA (35×35) with surface-mount mounting.
• Power  Core supply operating range of 820 mV to 880 mV to match system-level power planning and regulator selection.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for industrial environments.
• RoHS Compliant  Meets RoHS requirements for lead-free assembly and regulatory compliance.
• Stratix V GX Family Transceiver Capability (Series-Level)  Stratix V GX devices include family-level high-speed transceiver options (series documentation references GX channels at family-defined Gigabit speeds).

Typical Applications

• High‑density digital processing  Use the large logic element count and on-chip RAM to implement complex FPGAs for signal processing, compute offload, or algorithm acceleration.
• Communications and networking  High I/O counts and family-level high-speed transceiver support make this device suitable for network interface and data-path designs.
• Industrial control systems  Industrial temperature rating (−40 °C to 100 °C) and robust packaging support demanding control and automation environments.
• Board-level integration  Compact 1152‑FBGA (35×35) package and surface-mount mounting simplify integration into dense, multi-board assemblies.

Unique Advantages

• Substantial on-chip resources: 420,000 logic elements and approximately 37.9 Mbits of embedded RAM reduce external memory dependence and simplify system architecture.
• High I/O count: 432 device I/O pins allow broad external interfacing without extensive multiplexing or external expanders.
• Industrial temperature operation: Rated from −40 °C to 100 °C for reliable operation in industrial environments.
• Compact, manufacturable package: 1152‑BBGA / 1152‑FBGA (35×35) surface-mount package supports dense PCB layouts and automated assembly.
• Series-level high-speed transceiver options: Stratix V GX family documentation includes high-speed transceiver capability for designs that require fast serial links.
• Regulated core voltage range: Core supply between 820 mV and 880 mV helps precise power budgeting for high-performance designs.

Why Choose 5SGXEA4K2F35I2L?

The 5SGXEA4K2F35I2L delivers a combination of large logic capacity, significant embedded memory, and high I/O density in an industrial-temperature, surface-mount FBGA package. It is positioned for system designs that require extensive on-chip resources and reliable operation across a wide temperature range.

This device is well suited to engineering teams developing integration-heavy FPGA applications—where reducing external components, maintaining robust thermal and power margins, and supporting numerous external interfaces are priorities. Its family-level documentation for high-speed transceivers further supports designs that require advanced serial connectivity.

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