5SGXEA4K2F35C2N

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 37888000 420000 1152-BBGA, FCBGA

Quantity 724 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs158500Number of Logic Elements/Cells420000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits37888000

Overview of 5SGXEA4K2F35C2N – Stratix® V GX Field Programmable Gate Array (FPGA), 420000 logic elements, ~38 Mbits RAM, 432 I/Os

The 5SGXEA4K2F35C2N is a Stratix® V GX field programmable gate array (FPGA) IC provided in a 1152-BBGA (35 × 35 mm) FCBGA package for surface-mount applications. The device offers 420,000 logic elements and approximately 38 Mbits of embedded memory, together with 432 general-purpose I/Os and Stratix V GX family electrical and switching characteristics documented in the device datasheet.

Designed for commercial-temperature applications (0 °C to 85 °C), this part operates with a core supply in the 870 mV to 930 mV range and is supplied in a 1152-FBGA package format. The Stratix V GX family datasheet provides detailed electrical and transceiver-related characteristics relevant to integration and system design.

Key Features

  • Core and Logic  420,000 logic elements suitable for high-density programmable logic implementations.
  • Embedded Memory  Approximately 38 Mbits of on-chip RAM for buffering, state storage, and data-path implementations.
  • I/O and Periphery  432 device I/Os to support extensive external connectivity and system interfacing.
  • Package and Mounting  1152-BBGA (FCBGA) supplier package (1152-FBGA, 35 × 35 mm) with surface-mount mounting for compact board-level integration.
  • Power  Core voltage supply range of 870 mV to 930 mV, enabling design alignment with specified power rails.
  • Operating Conditions  Commercial-grade operation across 0 °C to 85 °C as specified for the device.
  • Standards and Documentation  Device electrical and switching characteristics, including I/O timing and transceiver information, are described in the Stratix V device datasheet.
  • Regulatory Status  RoHS compliant.

Typical Applications

  • High-density digital processing  Implement compute-intensive, logic-rich functions using the device’s 420,000 logic elements and significant on-chip RAM.
  • Embedded memory–dependent designs  Use the approximately 38 Mbits of embedded memory for buffering, FIFOs, and intermediate data storage inside the FPGA fabric.
  • High I/O connectivity systems  Leverage 432 I/Os for multi-channel connectivity, control-plane interfaces, and broad peripheral integration.
  • FPGA-based development and prototyping  Employ the Stratix V GX device and its documented electrical characteristics for system-level validation and functional prototyping.

Unique Advantages

  • Large logic capacity: 420,000 logic elements provide substantial programmable resources for complex designs.
  • Significant on-chip RAM: Approximately 38 Mbits of embedded memory reduces external memory dependencies for many use cases.
  • High I/O count: 432 I/Os enable broad external interfacing and flexible board-level connectivity.
  • Compact FCBGA package: 1152-BBGA (35 × 35 mm) package allows dense board integration while maintaining the available I/O and logic resources.
  • Commercial-temperature qualification: Rated for 0 °C to 85 °C operation to support standard commercial applications.
  • Datasheet-backed specifications: Electrical, switching, I/O timing, and transceiver details are documented in the Stratix V device datasheet for design validation.

Why Choose 5SGXEA4K2F35C2N?

The 5SGXEA4K2F35C2N combines high logic density, substantial embedded memory, and a large I/O complement in a compact 1152-BBGA FCBGA package. Its documented Stratix V GX electrical and switching characteristics support design decisions where on-chip resources and verified I/O behavior are required.

This part is suited for teams and designs that require dense programmable logic, significant on-chip RAM, and extensive I/O in a commercial-temperature device. The combination of these measurable specifications supports scalable implementations and system integration backed by the Stratix V device documentation.

Request a quote or submit an inquiry to purchase the 5SGXEA4K2F35C2N and receive pricing and availability information for your design requirements.

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