5SGXEA4K2F35C2LN

The Intel 5SGXEA4K2F35C2LN is a Stratix V GX family FPGA in a 1152-BBGA FCBGA package designed for commercial applications. It integrates 420,000 logic elements and approximately 37.9 Mbits of embedded memory to support dense logic and on-chip data buffering.

With 432 I/O pins, a low-voltage core (0.82–0.88 V), and surface-mount packaging, this device targets high-density, high-performance designs that require large logic capacity, abundant I/O, and commercial-temperature operation.

Key Features

• Core Logic 420,000 logic elements for implementing large, complex digital designs.
• Embedded Memory Approximately 37.9 Mbits of on-chip RAM to support data buffering, state storage, and local memory needs.
• I/O Capacity 432 user I/O pins suitable for high pin-count interfaces and multi-channel system designs.
• Power Core supply voltage range of 0.820 V to 0.880 V, enabling operation within the device’s specified low-voltage core window.
• Package & Mounting Available in a 1152-BBGA (FCBGA) package; supplier device package listed as 1152-FBGA (35×35). Surface-mount mounting type for standard PCB assembly.
• Temperature Grade Commercial operating temperature range of 0 °C to 85 °C.
• Regulatory RoHS compliant.
• Stratix V GX Series Details Series-level device documentation includes Stratix V GX electrical and transceiver characteristics and speed-grade information as published in the Stratix V device datasheet.

Typical Applications

• High-speed communications & networking — Device density and series-level transceiver options documented in the Stratix V GX datasheet make the part suitable for network line cards and packet processing where large logic fabrics and many I/Os are required.
• High-density I/O systems — 432 I/O pins allow integration of multiple parallel interfaces, sensors, or front-end channels in a single FPGA package.
• Compute acceleration and signal processing — Large logic and embedded RAM support implementation of algorithmic pipelines and on-chip buffering for compute-intensive workloads.

Unique Advantages

• Large logic capacity: 420,000 logic elements provide the resources to consolidate multiple functions into one device and reduce system-level component count.
• Substantial embedded memory: Approximately 37.9 Mbits of on-chip RAM reduces dependence on external memory for many buffering and state-storage needs.
• High I/O count: 432 I/O pins support complex, high-pin-count board-level integration and multiple peripheral interfaces.
• Compact, manufacturable package: 1152-BBGA / 1152-FBGA (35×35) package in a surface-mount form factor simplifies PCB layout for dense systems.
• Commercial-grade operation: Specified for 0 °C to 85 °C operation and RoHS compliant for standard commercial applications.
• Documented series characteristics: Electrical and transceiver specifications for the Stratix V GX family are provided in the device datasheet for design verification and planning.

Why Choose 5SGXEA4K2F35C2LN?

The 5SGXEA4K2F35C2LN combines high logic density, significant on-chip memory, and a large I/O count in a compact BGA package—making it a solid option for commercial designs that require consolidated logic, abundant local storage, and many external interfaces. Its documented Stratix V GX electrical and transceiver characteristics enable informed system-level design and integration.

This device is suited to engineering teams building high-density FPGA-based systems where on-chip resources and I/O capacity drive board-level consolidation and performance. The commercial temperature rating and RoHS compliance support standard production deployment and regulatory requirements.

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