5SGXEA4K2F40C1N

The 5SGXEA4K2F40C1N is a Stratix V GX family FPGA from Intel, delivered in a 1517-BBGA FCBGA package for surface-mount assembly. It provides high logic capacity, substantial on-chip memory, and a large I/O complement for demanding digital designs.

This commercial-grade device is targeted at applications that require dense logic integration and extensive I/O, with device-level electrical and transceiver characteristics defined by the Stratix V GX series datasheet.

Key Features

• Core logic density: 420,000 logic elements for complex logic, glue-less integration, and large-scale programmable design implementation.
• Embedded memory: Approximately 37.9 Mbits of embedded memory (37,888,000 total RAM bits) to support buffering, on-chip data storage, and algorithm implementation.
• I/O capacity: 696 I/O pins to support wide parallel interfaces, multiple high-pin-count peripherals, and flexible board-level connectivity.
• Transceiver capability (series-level): Stratix V GX series transceiver offerings are documented in the device datasheet and include multiple transceiver speed grades (series-level information).
• Power and supply: Core voltage supply range of 870 mV to 930 mV to match system power-rail planning and core power budgeting.
• Package and mounting: 1517-BBGA FCBGA (supplier package 1517-FBGA, 40×40) in a surface-mount form factor for high-density PCB integration.
• Operating conditions: Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Compliance: RoHS compliant, supporting environmental and manufacturing requirements for lead-free assembly.

Typical Applications

• High-speed serial interfaces: Leverage the Stratix V GX family transceiver capabilities (series-level) and high I/O count for high-bandwidth serial link implementations.
• Packet processing and networking: Large logic capacity and substantial on-chip memory enable packet inspection, buffering, and custom network functions.
• Compute- and memory-intensive FPGA designs: The combination of 420,000 logic elements and ~37.9 Mbits of embedded memory supports complex DSP, acceleration, and algorithm offload tasks.
• Prototyping and system integration: High I/O, large logic resources, and a standard FCBGA package make the device suitable for board-level prototyping and integration into high-density systems.

Unique Advantages

• High logic integration: 420,000 logic elements allow consolidation of multiple functions into a single device, reducing BOM and board complexity.
• Significant on-chip memory: Approximately 37.9 Mbits of embedded RAM reduces external memory dependence and improves data-path efficiency.
• Extensive connectivity: 696 I/O pins provide broad interface flexibility for parallel buses, multiple peripherals, and mixed-signal front-ends.
• Commercial-grade thermal profile: Rated for 0 °C to 85 °C operation to match typical commercial system environments and deployment conditions.
• Industry-standard packaging: 1517-BBGA FCBGA (1517-FBGA, 40×40) supports high-density PCB layouts and established assembly flows.
• RoHS compliance and Intel support: RoHS compliant and backed by Intel’s Stratix V family documentation and datasheet coverage for electrical and switching characteristics.

Why Choose 5SGXEA4K2F40C1N?

The 5SGXEA4K2F40C1N combines large logic resources, substantial embedded memory, and a high I/O count in a commercial-grade Stratix V GX FPGA package. It is suited to designs that require dense programmable logic, broad interface support, and series-level transceiver capability as documented for Stratix V GX devices. Manufacturers and designers who need a high-capacity, surface-mount FPGA solution with clear electrical and operating specifications will find this device appropriate for complex digital, networking, and compute-acceleration projects.

Request a quote or submit a sales inquiry today to get pricing and availability for the 5SGXEA4K2F40C1N and evaluate it for your next design.