5SGXEA4K2F40C3N

The 5SGXEA4K2F40C3N is a Stratix® V GX family FPGA from Intel, supplied in a 1517-BBGA (1517-FBGA, 40×40) surface-mount package. It provides a high-density programmable fabric with a large number of logic elements and embedded RAM to implement complex digital systems within a commercial temperature grade.

Targeted at designs that require substantial logic capacity, plentiful on-chip memory, and extensive I/O connectivity, this device brings Stratix V GX architecture into applications that demand significant integration and configurability.

Key Features

• Logic Capacity  Approximately 420,000 logic elements to implement large-scale digital logic, custom accelerators, and complex control systems.
• Embedded Memory  Approximately 38 Mbits of embedded memory (total RAM bits 37,888,000) for buffering, on-chip data storage, and algorithm state.
• I/O Density  696 user I/O pins to support numerous interfaces, parallel buses, and high pin-count peripherals.
• Power Supply  Core voltage supply range of 820 mV to 880 mV for defined power and performance operating points.
• Package & Mounting  1517-BBGA (Supplier device package: 1517-FBGA, 40×40) in a surface-mount FCBGA form factor to support compact board designs.
• Temperature & Grade  Commercial temperature grade with operating range from 0 °C to 85 °C for standard commercial deployments.
• Standards Compliance  RoHS compliant for regulatory alignment in lead-free manufacturing environments.

Typical Applications

• High-density digital logic and acceleration  Use the large logic element count and embedded memory to implement custom datapaths, hardware accelerators, and complex state machines.
• I/O-rich interface bridging  Leverage 696 I/O pins for multi-protocol bridging, wide parallel buses, and dense peripheral connectivity.
• Communications and networking systems  As a Stratix V GX family device, it is suitable for designs that integrate high-throughput logic and on-chip memory for packet processing and protocol handling.

Unique Advantages

• High integration density:  Large logic and memory resources reduce the need for external glue logic and off-chip RAM, simplifying system BOM and board area.
• Extensive I/O connectivity:  Nearly 700 I/O pins enable direct interfacing to many peripherals and high-pin-count connectors without additional multiplexing.
• Compact BGA footprint:  1517-FBGA (40×40) packaging provides a compact solution for high-pin-count FPGAs in space-constrained designs.
• Commercial-grade operating range:  Rated for 0 °C to 85 °C operation, aligning with standard commercial product deployment environments.
• Regulatory readiness:  RoHS compliance supports lead-free manufacturing and environmental regulations.

Why Choose 5SGXEA4K2F40C3N?

The 5SGXEA4K2F40C3N combines substantial programmable logic, significant on-chip memory, and high I/O density in a compact surface-mount FCBGA package, offering a balanced platform for complex commercial designs. It is well suited to engineering teams developing compute-heavy, I/O-intensive, or highly integrated digital systems that require the configurability of the Stratix V GX family.

Backed by Intel's Stratix V documentation and electrical-characteristics guidance, this device provides a verifiable specification set—logic capacity, memory resources, supply voltage, I/O count, package, and operating range—that supports design planning and system-level integration decisions.

If you would like pricing, availability, or a formal quote for 5SGXEA4K2F40C3N, submit a request or quote inquiry and our team will respond with the necessary procurement details.