5SGXEA4K2F40I2L

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 37888000 420000 1517-BBGA, FCBGA

Quantity 522 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs158500Number of Logic Elements/Cells420000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits37888000

Overview of 5SGXEA4K2F40I2L – Stratix® V GX Field Programmable Gate Array (FPGA), 420,000 logic elements

The 5SGXEA4K2F40I2L is an Intel Stratix V GX Field Programmable Gate Array supplied in a 1517‑BBGA (FCBGA) package. It delivers high-density programmable logic with substantial on-chip RAM and a large I/O count for demanding industrial applications.

Designed for systems that require extensive logic capacity, embedded memory, and flexible I/O, this industrial‑grade FPGA supports operation from –40 °C to 100 °C and a core supply range of 820 mV to 880 mV.

Key Features

  • High-density logic  Approximately 420,000 logic elements provide a large resource pool for complex digital designs and parallel processing.
  • Embedded memory  Approximately 37.888 Mbits of on-chip RAM to support large buffers, FIFOs, and state storage without external memory.
  • Extensive I/O  696 user I/O pins for rich peripheral connectivity and system interface options.
  • Power and core voltage  Core voltage supply specified between 820 mV and 880 mV, supporting precise power delivery and core performance tuning.
  • Industrial temperature grade  Rated for operation from –40 °C to 100 °C, suitable for industrial ambient environments.
  • Package and mounting  1517‑BBGA (FCBGA) package, supplier device package 1517‑FBGA (40×40), and surface mount mounting type for compact board integration.
  • RoHS compliance  Material compliance aligns with RoHS environmental requirements.

Typical Applications

  • High‑speed serial interfaces  Stratix V GX devices include transceiver-oriented device variants and speed grades, making this FPGA suitable where high‑speed serial connectivity is required.
  • High‑density digital processing  Large logic element and embedded memory counts enable complex signal processing, packet processing, and data path implementations.
  • Industrial control and instrumentation  Industrial temperature rating and robust package options support deployment in industrial monitoring, control, and instrumentation equipment.
  • System prototyping and deployment  A high logic and I/O resource set supports prototyping of custom SoC functions and deployment in production systems needing reconfigurability.

Unique Advantages

  • Large programmable fabric: The approximately 420k logic elements provide design headroom for complex algorithms and parallel architectures, reducing the need for multiple devices.
  • Significant on‑chip RAM: Approximately 37.888 Mbits of embedded memory lowers dependence on external memory, simplifies board design, and improves data throughput.
  • Wide I/O capability: With 696 I/O pins, the device can interface to many peripherals and subsystems without external multiplexing.
  • Industrial operating range: Rated –40 °C to 100 °C and marked as industrial grade for applications that require extended temperature operation.
  • Compact FCBGA packaging: The 1517‑BBGA package supports a high I/O and logic density in a compact footprint for space‑constrained designs.
  • Controlled core voltage: The specified 820–880 mV supply window supports predictable core behavior and system power budgeting.

Why Choose 5SGXEA4K2F40I2L?

The 5SGXEA4K2F40I2L positions itself as a high‑capacity Stratix V GX FPGA option when your design demands a large logic fabric, sizable embedded memory, and a high I/O count in an industrial‑rated device. Its combination of approximately 420,000 logic elements, roughly 37.888 Mbits of on‑chip RAM, and 696 I/Os makes it well suited for complex digital processing, high‑throughput data paths, and systems requiring substantial interface options.

Delivered in a 1517‑BBGA FCBGA package with surface‑mount compatibility and RoHS compliance, this device is aimed at engineers and system designers who require scalable, reprogrammable hardware resources with predictable electrical and thermal operating windows.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for part number 5SGXEA4K2F40I2L.

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