5SGXEA4K2F40I2N

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 37888000 420000 1517-BBGA, FCBGA

Quantity 113 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs158500Number of Logic Elements/Cells420000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits37888000

Overview of 5SGXEA4K2F40I2N – Stratix V GX FPGA, 420,000 logic elements, 696 I/Os

The 5SGXEA4K2F40I2N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, provided in a 1517-BBGA FCBGA package. It delivers a high-density programmable logic fabric with substantial on-chip RAM and a large I/O complement for complex, memory- and I/O-intensive designs.

Designed and graded for industrial use, this device combines a large logic capacity, significant embedded memory, and wide operating temperature tolerance to address demanding system requirements where density and reliable operation across environments are required.

Key Features

  • Logic Capacity  Approximately 420,000 logic elements to implement large, complex digital functions and custom processing pipelines.
  • Embedded Memory  Approximately 37.9 Mbits of on-chip RAM for buffering, lookup tables, and temporary storage directly within the FPGA fabric.
  • High I/O Count  696 I/O pins to support extensive external interfacing and multi-channel connectivity.
  • Industrial Temperature Grade  Rated for operation from -40 °C to 100 °C, suitable for industrial environment deployments.
  • Low-Voltage Core  Core supply range of 870 mV to 930 mV to match system power-rail requirements for Stratix V devices.
  • Package and Mounting  1517-BBGA (FCBGA) package with supplier package noted as 1517-FBGA (40×40); surface-mountable for standard PCB assembly.
  • Compliance  RoHS compliant.

Typical Applications

  • High-density logic integration  Use the approximately 420,000 logic elements and approx. 37.9 Mbits of embedded memory to consolidate complex logic and stateful functions into a single device.
  • I/O-intensive systems  Leverage 696 I/Os for designs that require large numbers of external interfaces or parallel channel connectivity.
  • Industrial equipment  Industrial-grade temperature range and RoHS compliance make this device suitable for control, instrumentation, and automation applications operating across a wide temperature span.

Unique Advantages

  • High integration density: Consolidate multiple functions into a single FPGA with approximately 420,000 logic elements, reducing board-level component count.
  • Generous on-chip memory: Approximately 37.9 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
  • Extensive external connectivity: 696 I/Os enable flexible interfacing to peripherals, sensors, and multi-channel systems without external I/O expanders.
  • Industrial robustness: Rated for -40 °C to 100 °C operation to meet the thermal demands of industrial environments.
  • Compact, surface-mount package: 1517-BBGA (1517-FBGA, 40×40) package supports dense PCB layouts while remaining compatible with standard assembly processes.
  • Regulatory alignment: RoHS compliance simplifies use in markets and products with lead-free requirements.

Why Choose 5SGXEA4K2F40I2N?

The 5SGXEA4K2F40I2N positions itself as a high-density Stratix V GX FPGA option offering a blend of large logic capacity, substantial on-chip memory, and high I/O density in an industrial-grade package. Its voltage and temperature specifications make it suitable for systems that demand reliable operation across a wide range of environmental conditions.

This device is appropriate for designers seeking to consolidate complex digital subsystems, implement large buffering or LUT-based functions on-chip, and interface with many external channels while maintaining a compact PCB footprint.

Request a quote or submit an inquiry for pricing and availability of the 5SGXEA4K2F40I2N to start evaluating it for your next design.

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