5SGXEA4K2F40I3G

The 5SGXEA4K2F40I3G is a Stratix® V GX field programmable gate array (FPGA) from Intel, designed for high-density logic and memory integration in industrial-grade applications. It combines a large programmable fabric, substantial on-chip embedded memory, and a high pin-count I/O footprint in a compact BGA package.

Designed for surface-mount assembly and rated for industrial temperature operation, this device targets applications that require dense logic resources, extensive embedded RAM, and broad I/O connectivity within a reliable package and defined supply range.

Key Features

• High Logic Density 420,000 logic elements for implementing complex digital systems and large-scale custom logic.
• Substantial Embedded Memory Approximately 38 Mbits of on-chip RAM to support large buffers, packet processing, or data-path storage.
• Extensive I/O 696 user I/Os to facilitate dense board-level connectivity and multiple high-pin-count interfaces.
• Industrial Temperature Grade Specified operating range from −40 °C to 100 °C for deployment in industrial environments.
• Optimized Power Domain Core supply requirement specified at 0.820 V to 0.880 V for system power budgeting and design.
• Package and Mounting 1517-BBGA (FCBGA) package, supplier package 1517-FBGA (40×40), designed for surface-mount assembly.
• Standards Compliance RoHS compliant to support environmental and manufacturing requirements.

Typical Applications

• Network and Communications Dense logic and abundant on-chip RAM support packet buffering, protocol processing, and custom datapath logic where large I/O counts are required.
• High-Performance Computing Modules Large logic capacity enables custom accelerators and data-flow engines within constrained board area using the 1517-BBGA footprint.
• Industrial Control Systems Industrial temperature rating and extensive I/Os make it suitable for complex control, monitoring, and I/O aggregation tasks.

Unique Advantages

• Large Programmable Fabric: 420,000 logic elements give designers headroom for complex algorithms and multi-function designs without external glue logic.
• On-chip Memory for Data-Intensive Tasks: Approximately 38 Mbits of embedded RAM reduces dependence on external memory for buffering and state storage.
• High I/O Count for System Integration: 696 I/Os simplify integration of multiple interfaces and peripherals on a single device, lowering BOM complexity.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to meet the thermal requirements of many industrial deployments.
• Compact BGA Package: 1517-BBGA (FCBGA) 40×40 supplier package enables high-density board designs while supporting surface-mount assembly.
• Controlled Core Voltage Range: Core supply defined between 0.820 V and 0.880 V assists accurate power planning and thermal design.

Why Choose 5SGXEA4K2F40I3G?

The 5SGXEA4K2F40I3G positions itself as a high-density Stratix V GX FPGA option for designs that demand significant logic resources, substantial on-chip RAM, and wide I/O capability within an industrial temperature envelope. Its BGA packaging and surface-mount form factor enable compact board layouts while supporting robust system-level integration.

This device suits engineering teams developing complex communication, compute-acceleration, and industrial-control solutions that require a balance of logic capacity, embedded memory, and connectivity, backed by Intel’s Stratix V device family documentation and manufacturing footprint.

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