5SGXEA4K2F40I3L

The 5SGXEA4K2F40I3L is an Intel Stratix V GX field-programmable gate array offered in an industrial-grade, surface-mount FCBGA package. It delivers very high logic density and on-chip memory capacity together with a large programmable I/O count, making it suitable for demanding digital and connectivity applications.

Key hardware characteristics include 420,000 logic elements, approximately 38 Mbits of embedded RAM, 696 I/O pins, and operation across an industrial temperature range (‑40 °C to 100 °C). The device operates from a core voltage supply of 820 mV to 880 mV and is provided in a 1517‑BBGA / 1517‑FBGA (40×40) package.

Key Features

• Core and Logic Density 420,000 logic elements and 158,500 logic cells (as specified) provide extensive programmable logic resources for complex designs.
• Embedded Memory Approximately 38 Mbits of on-chip RAM to support buffering, packet processing, and large working datasets without external memory for many use cases.
• I/O and Connectivity 696 user I/O pins for wide external interfacing and routing to high-pin-count systems and daughtercards.
• Package and Mounting 1517‑BBGA / 1517‑FBGA (40×40) surface-mount package optimized for compact, high-density board layouts.
• Power Core supply voltage range: 820 mV to 880 mV, enabling predictable power domain planning for designs using Stratix V devices.
• Temperature and Grade Industrial grade operation from ‑40 °C to 100 °C for deployment in temperature-challenging environments.
• Standards Compliance RoHS compliant.

Typical Applications

• High-density digital processing — Implement large custom datapaths, packet engines, and hardware accelerators using the device’s extensive logic and memory resources.
• High I/O interface systems — Leverage 696 I/Os to connect to multiple high-speed front-ends, protocol converters, or mezzanine cards.
• Industrial control and instrumentation — Industrial temperature rating and surface-mount FCBGA packaging make the device suitable for embedded control, motor drives, and process automation where rugged operation is required.
• Communications and networking — Part of the Stratix V GX family, providing architecture suited to designs that require substantial logic, memory, and I/O for networking functions.

Unique Advantages

• High programmable capacity: 420,000 logic elements enable implementation of very large custom logic designs without partitioning across multiple devices.
• Significant on-chip RAM: Approximately 38 Mbits of embedded memory reduces dependency on external memory for buffering and local datasets.
• Extensive I/O resources: 696 I/Os allow flexible interfacing to a wide variety of peripherals, sensors, and high-speed links.
• Industrial temperature operation: Rated from ‑40 °C to 100 °C for reliable performance in industrial deployments.
• Compact, production-ready package: 1517‑FBGA (40×40) surface-mount package supports dense PCB integration while meeting manufacturing requirements.
• Regulatory preparedness: RoHS compliance supports environmental and manufacturing compliance requirements.

Why Choose 5SGXEA4K2F40I3L?

The 5SGXEA4K2F40I3L offers a combination of very high logic density, substantial embedded memory, and a large I/O count in an industrial-grade Stratix V GX device. These attributes make it well suited to complex digital processing, high‑I/O communications, and industrial embedded systems that require robust operation across wide temperature ranges.

For designs that demand scalability in logic and memory while maintaining predictable power and thermal constraints, this device provides a platform capable of consolidating functions and simplifying board-level integration.

Request a quote or submit an inquiry to purchase 5SGXEA4K2F40I3L and evaluate how this Stratix V GX FPGA fits your next high-density design.