5SGXEA4K3F35C2G

The 5SGXEA4K3F35C2G is a Stratix® V GX field programmable gate array (FPGA) IC from Intel, offered in a 1152-BBGA FCBGA package. It provides a high-density programmable logic fabric with substantial embedded memory and a large I/O count for complex system integration.

With 420,000 logic elements and approximately 37.9 Mbits of on-chip RAM, this commercial-grade device targets designs that need significant logic capacity, on-chip memory, and extensive I/O in a surface-mount, ball-grid array package.

Key Features

• Core Logic  420,000 logic elements provide substantial programmable logic capacity for large, multi-function designs.
• Embedded Memory  Approximately 37.9 Mbits of on-chip RAM to support buffering, state machines, and data processing without external memory for many tasks.
• I/O Density  432 user I/O pins to interface with high-channel-count peripherals and complex system-level connectivity.
• Package & Mounting  Supplied in a 1152-BBGA (1152-FBGA, 35×35) FCBGA package for surface-mount assembly where high pin density is required.
• Power  Core voltage supply range specified from 870 mV to 930 mV, enabling predictable core power design and regulation.
• Commercial Grade & Temperature  Commercial grade device rated for operation from 0 °C to 85 °C, suited to standard commercial-environment electronics.
• Compliance  RoHS compliant, supporting lead-free manufacturing and regulatory expectations for commercial products.

Typical Applications

• High-density logic systems  Large-scale programmable logic implementations that require hundreds of thousands of logic elements and substantial embedded RAM.
• Multi‑channel I/O aggregation  Systems needing dozens to hundreds of external interfaces can leverage the device’s 432 I/O pins for parallel connectivity and peripheral integration.
• On-chip buffering and data handling  Designs that benefit from significant on-chip memory for buffering, packet handling, or intermediate data storage without immediate external memory.

Unique Advantages

• High logic capacity: 420,000 logic elements enable consolidation of complex functions onto a single FPGA, reducing inter-component wiring and BOM complexity.
• Substantial embedded memory: Approximately 37.9 Mbits of on-chip RAM supports data-intensive tasks and reduces dependence on external memory for many designs.
• Extensive I/O resources: 432 I/O lines provide design flexibility for interfacing a wide range of peripherals and system components.
• Compact, high-density packaging: 1152-BBGA (35×35) package delivers high pin count in a surface-mount form factor suitable for space-constrained PCBs.
• Predictable power envelope: Defined core supply range (870 mV–930 mV) simplifies power-supply selection and thermal planning.
• Commercial readiness: Commercial temperature rating (0 °C–85 °C) and RoHS compliance support standard commercial product lifecycles and manufacturing.

Why Choose 5SGXEA4K3F35C2G?

The 5SGXEA4K3F35C2G combines a high count of logic elements, significant embedded RAM, and a large I/O complement in a high-density 1152-BBGA package—making it a solid choice for commercial designs that require consolidated programmable logic and on-chip memory. Its clearly defined power and temperature specifications support predictable integration into commercial electronics assemblies.

Engineers and procurement teams seeking a Stratix® V GX FPGA with proven specifications and RoHS compliance can consider this device for designs that demand scale, connectivity, and package-level integration while maintaining standard commercial temperature operation.

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