5SGXEA4K3F35C2N

The 5SGXEA4K3F35C2N is a Stratix V GX family FPGA in a 1152-BBGA FCBGA package designed for high-capacity programmable logic applications. It provides a large logic fabric and embedded memory suited for designs that require substantial on-chip resources and a high I/O count.

Manufactured for commercial-grade applications, this surface-mount FPGA combines 420,000 logic elements, approximately 37.9 Mbits of embedded RAM, and up to 432 I/O pins to support complex, memory‑intensive implementations within a compact 35×35 mm package footprint.

Key Features

• Logic Resources — 420,000 logic elements and 158,500 logic blocks provide extensive programmable resources for complex digital designs.
• Embedded Memory — Approximately 37.9 Mbits of on-chip RAM to support large buffering, state machines, and embedded data structures without external memory.
• I/O Capacity — 432 available I/O pins to interface with multiple peripherals, bus systems, and high-pin-count connectivity requirements.
• Supply Voltage — Core voltage range of 870 mV to 930 mV for defined power budgeting and supply design.
• Package and Mounting — 1152-BBGA (supplier package: 1152-FBGA, 35×35) in a surface-mount form factor for high-density board assembly.
• Operating Range — Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Compliance — RoHS compliant to meet modern environmental and manufacturing requirements.

Typical Applications

• High-density signal processing — Leverage the large logic element count and embedded RAM for FPGA-implemented DSP pipelines and parallel data processing.
• Protocol bridging and interface aggregation — Use the 432 I/Os to connect and manage multiple interfaces or bus systems in a single device.
• Memory-centric acceleration — On-chip RAM supports buffering and state-holding for accelerators, packet buffering, or custom memory controllers.

Unique Advantages

• Substantial programmable capacity: 420,000 logic elements enable implementation of large, complex designs without partitioning across multiple devices.
• Significant on-chip memory: Approximately 37.9 Mbits of embedded RAM reduces dependency on external memory and improves latency for data-critical functions.
• High I/O density: 432 I/Os accommodate expansive peripheral and interface connectivity, simplifying board-level integration.
• Compact, manufacturable package: 1152-FBGA (35×35) surface-mount package delivers high integration in a form factor compatible with modern PCB assembly processes.
• Defined power envelope: Narrow core supply range (870 mV–930 mV) assists in straightforward power-supply design and thermal planning.
• RoHS compliant and commercial grade: Meets environmental compliance requirements for mainstream electronic products.

Why Choose 5SGXEA4K3F35C2N?

The 5SGXEA4K3F35C2N positions itself as a high-capacity Stratix V GX FPGA option for commercial applications that demand extensive logic, large embedded memory, and broad I/O. Its combination of 420,000 logic elements, approximately 37.9 Mbits of RAM, and 432 I/Os in a 1152‑FBGA (35×35) package provides a balanced platform for complex data processing, interface consolidation, and memory‑intensive acceleration tasks.

Designed for engineers seeking a scalable, integrated solution with clear electrical and thermal bounds (870 mV–930 mV core voltage, 0 °C–85 °C operating range) and RoHS compliance, this device supports robust implementation and easier system-level integration within commercial product lines.

Request a quote or submit a specification request to evaluate 5SGXEA4K3F35C2N for your next design and obtain pricing and availability details.