5SGXEA4K3F35C2LG

The 5SGXEA4K3F35C2LG is an Intel Stratix V GX field-programmable gate array supplied in a 1152-FBGA (35 × 35 mm) package for surface-mount applications. It provides high on-chip logic capacity, substantial embedded memory, and a large I/O count targeted at designs that require dense programmable logic and flexible I/O provisioning.

As a commercial-grade Stratix V GX device, this part combines core FPGA resources with Stratix V GX family transceiver options and documented operating characteristics to support high-performance, programmable hardware implementations.

Key Features

• Logic Capacity — 420,000 logic elements for implementing large-scale digital designs and complex custom logic functions.
• Embedded Memory — Approximately 37.9 Mbits of on-chip RAM to support buffering, lookup tables, and local storage for data-path and control logic.
• I/O Resources — 432 I/O pins to interface with peripherals, memory, and board-level subsystems.
• Transceiver Options — Stratix V GX family transceiver speed grades are available, including GX channel options up to 14.1 Gbps as documented for the series.
• Power and Core Voltage — Core voltage supply range of 820 mV to 880 mV, enabling precise power provisioning in system designs.
• Package & Mounting — 1152-BBGA FCBGA (1152-FBGA, 35 × 35 mm) surface-mount package for high-density board integration.
• Commercial Temperature Grade — Rated for commercial operation with an operating temperature range of 0 °C to 85 °C.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• High-speed serial interfaces — Designs requiring Stratix V GX transceivers can leverage the family’s documented channel speed grades (up to 14.1 Gbps) for high-bandwidth links.
• Custom logic acceleration — Implement large, latency-sensitive datapaths using the device’s 420,000 logic elements and embedded RAM.
• Prototyping and system integration — High I/O count (432 pins) and a compact 1152-FBGA package suit board-level prototyping and integration where dense connectivity is needed.

Unique Advantages

• Substantial logic density: 420,000 logic elements enable consolidation of complex functions and reduce the need for multiple devices.
• Significant embedded memory: Approximately 37.9 Mbits of on-chip RAM supports large buffers and state storage without external memory for many use cases.
• High I/O availability: 432 I/O pins provide flexible interfacing to peripherals, sensors, memory, and board-level buses.
• Family-level transceiver capability: Stratix V GX transceiver speed grades documented for the series (including up to 14.1 Gbps) allow designers to target high-speed serial links when required.
• Commercial-grade operation: Rated 0 °C to 85 °C, matching common commercial system requirements.
• RoHS compliant: Meets common environmental compliance requirements for lead-free assemblies.

Why Choose 5SGXEA4K3F35C2LG?

This Stratix V GX device combines high logic capacity, substantial embedded RAM, and a large I/O complement in a compact 1152-FBGA package, making it suitable for designers who need dense programmable logic and flexible board-level interfacing within a commercial temperature range. Its documented Stratix V family characteristics, including GX transceiver speed grade options, provide a clear technical foundation for high-performance FPGA designs.

Backed by Intel's Stratix V device documentation, the 5SGXEA4K3F35C2LG is positioned for engineering teams building complex digital systems that require scalable logic resources, reliable power specifications, and a compact surface-mount package.

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