5SGXEA4K3F35C3N

The 5SGXEA4K3F35C3N is a Stratix V GX field programmable gate array (FPGA) IC from Intel. This commercial-grade device delivers a high-density programmable fabric with substantial on‑chip memory and a large, flexible I/O complement for complex digital designs and system-level integration.

Documented as part of the Stratix V family, the device’s electrical and switching characteristics are covered in the series datasheet, including core and periphery performance and transceiver-related information for Stratix V GX devices.

Key Features

• Programmable Logic  Approximately 420,000 logic elements providing a high-density fabric for implementing large logic networks and custom datapaths.
• Logic Cluster Count  Logic cluster count listed as 158,500, useful for estimating partitioning and resource planning.
• Embedded Memory  Approximately 37.9 Mbits of total on‑chip RAM to support buffered data, FIFOs, and local storage for compute pipelines.
• I/O Capacity  432 user I/O pins to accommodate wide buses, multiple interfaces, and heterogeneous peripheral connections.
• Power and Core Supply  Core supply range specified at 820 mV to 880 mV, enabling precise power budgeting for the FPGA core.
• Package and Mounting  1152‑BBGA (FCBGA) package, supplier package 1152‑FBGA (35×35), designed for surface‑mount assembly.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for standard commercial applications.
• Standards Compliance  RoHS status: Compliant.

Typical Applications

• High-density digital processing  Use the large logic resource pool and on‑chip RAM to implement complex state machines, custom processors, and wide datapaths.
• Multi‑interface bridging  The 432 I/O pins enable protocol bridging and glue logic between multiple high‑pin-count subsystems.
• FPGA-based prototyping  High logic capacity and abundant RAM make this device suitable for system prototypes that require near-production complexity.

Unique Advantages

• High-density programmable fabric: Approximately 420,000 logic elements let designers consolidate complex logic and reduce external component count.
• Substantial embedded memory: Approximately 37.9 Mbits of on‑chip RAM supports buffering and local storage for performance-critical pipelines.
• Large I/O complement: 432 I/O pins provide flexibility for wide buses, parallel interfaces, and mixed-signal front ends.
• Industry-standard package: 1152‑BBGA (35×35 FBGA) enables high pin density in a surface-mount form factor for compact PCB designs.
• Commercial operating range: Rated 0 °C to 85 °C for standard commercial deployment and integration into temperature-controlled systems.

Why Choose 5SGXEA4K3F35C3N?

The 5SGXEA4K3F35C3N positions itself as a high‑density Stratix V GX FPGA suited to designs that require substantial logic resources, significant on‑chip RAM, and a broad I/O complement in a single surface‑mount package. Its commercial temperature grading and documented series electrical characteristics provide a clear basis for system-level power and timing planning.

This device is well suited to engineering teams building complex digital systems, multi‑interface controllers, or prototypes that demand scalable, programmable logic with robust memory and I/O capacity while maintaining RoHS compliance.

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