5SGXEA4K3F35I3G

The 5SGXEA4K3F35I3G is a Stratix® V GX Field Programmable Gate Array (FPGA) IC designed for high-density, high-performance digital systems. It integrates approximately 420,000 logic elements and substantial on-chip memory to support complex logic, large buffering, and data-path implementations. Targeted at industrial applications, this device offers a broad I/O count and a compact 1152-ball BGA package for surface-mount PCB assembly.

Key Features

• Core Logic  Approximately 420,000 logic elements to implement large-scale digital designs and custom accelerators.
• Embedded Memory  Approximately 38 Mbits of on-chip RAM for frame buffers, FIFOs, and state storage without external memory for many functions.
• I/O Capacity  432 general-purpose I/Os to interface with high-pin-count systems and multiple peripherals.
• Package & Mounting  1152-ball FCBGA (1152-FBGA, 35×35) package designed for surface-mount PCB assembly in space-constrained layouts.
• Power Supply  Core supply range specified at 820 mV to 880 mV to match system power-architecture requirements.
• Industrial Temperature Range  Rated for operation from –40°C to 100°C, meeting common industrial thermal requirements.
• Compliance  RoHS-compliant construction to support modern environmental directives and assembly processes.

Typical Applications

• High-performance networking  Use the device’s high logic density and large embedded memory to implement packet processing, traffic management, and protocol offload engines.
• Signal processing and acceleration  Leverage the abundant logic resources and on-chip RAM for real-time DSP pipelines, hardware accelerators, and data-path operations.
• Industrial control and automation  Industrial temperature rating and ample I/O make it suitable for complex control systems, motor control logic, and sensor aggregation.
• Prototyping and complex SoC integration  Use the Stratix V GX device to prototype large custom logic blocks and integrate custom peripherals for validation and system integration.

Unique Advantages

• High logic capacity: The large logic element count enables implementation of extensive custom logic and parallel processing architectures.
• Significant on-chip RAM: Approximately 38 Mbits of embedded memory reduce dependence on external memory for many buffering and temporary-storage needs, simplifying BOM and layout.
• High I/O density: 432 I/Os permit direct interfacing to multiple peripherals and high-pin-count connectors without additional multiplexing logic.
• Industrial-grade operation: Specified –40°C to 100°C operating range supports deployment in demanding environmental conditions.
• Compact system footprint: 1152-ball FCBGA package (35×35) provides a high-density package option for space-constrained designs while supporting surface-mount assembly.
• Defined core supply range: Core voltage specification (820 mV–880 mV) supports predictable power budgeting and thermal design.

Why Choose 5SGXEA4K3F35I3G?

The 5SGXEA4K3F35I3G positions itself as a high-density Stratix V GX FPGA option for engineering teams that require substantial logic capacity, large embedded memory, and extensive I/O in an industrial-rated device. Its package and surface-mount mounting style support compact system designs while the specified voltage and temperature ranges provide predictable integration into industrial systems.

This device is appropriate for customers developing complex networking, signal processing, and industrial control systems who need a scalable FPGA platform with robust on-chip resources and well-defined electrical and thermal characteristics.

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