5SGXEA4K3F35I3LG

The 5SGXEA4K3F35I3LG is an Intel Stratix® V GX field programmable gate array in a 1152-BBGA (1152‑FBGA, 35×35) surface-mount package. It provides a large fabric of programmable logic, substantial on‑chip memory, and a high I/O count in an industrial temperature grade.

This device suits designs that require dense programmable logic, significant embedded memory capacity, and extensive board-level interfacing — including applications that leverage high‑speed transceiver capabilities found in the Stratix V family.

Key Features

• Logic Capacity 420,000 logic elements for high-density, complex logic implementations.
• Embedded Memory Approximately 37.9 Mbits of on‑chip RAM to support buffering, FIFOs, and local data storage.
• I/O Resources 432 I/Os to accommodate a wide range of parallel and serial board interfaces.
• Package and Mounting 1152‑BBGA / 1152‑FBGA (35×35) surface‑mount package for compact, high‑pin‑count system integration.
• Power Domain Core voltage supply range of 820 mV to 880 mV for the FPGA core power domain.
• Thermal and Environmental Grade Industrial operating temperature range from −40 °C to 100 °C; RoHS compliant.
• Family Characteristics Stratix V GX series device — part of the Stratix V family that includes transceiver-capable devices and multiple speed grades as documented in the device datasheet.

Typical Applications

• High‑density FPGA systems — Implement large custom logic and control functions that require hundreds of thousands of logic elements.
• Buffering and on‑chip data storage — Use the device’s ~37.9 Mbits of embedded RAM for deep FIFOs, packet buffering, and local memory needs.
• Complex I/O subsystems — Leverage 432 I/Os for multi‑lane board interfaces, peripheral aggregation, and board-level signal routing.
• Industrial equipment — The −40 °C to 100 °C operating range supports deployment in industrial environments requiring extended temperature operation.
• Transceiver‑based designs — As a Stratix V GX device, it aligns with designs that make use of high‑speed transceiver capabilities available within the Stratix V family.

Unique Advantages

• High logic density: 420,000 logic elements enable complex, large‑scale FPGA designs without immediate need to partition across multiple devices.
• Substantial embedded memory: Approximately 37.9 Mbits of on‑chip RAM reduces external memory dependency for many buffering and data‑path tasks.
• Large I/O complement: 432 I/Os simplify board design for multi‑interface systems and reduce the need for external IO expanders.
• Industrial temperature rating: −40 °C to 100 °C operation supports reliable deployment in demanding thermal environments.
• Compact high‑pin package: 1152‑FBGA (35×35) allows high pin‑count routing in a space‑efficient surface‑mount form factor.
• Controlled core supply range: 820–880 mV core voltage specification supports precise power provisioning for the FPGA core domain.

Why Choose 5SGXEA4K3F35I3LG?

The 5SGXEA4K3F35I3LG combines a large logic fabric, significant on‑chip memory, and a high I/O count in an industrially rated Stratix V GX device and a compact 1152‑FBGA package. This combination makes it well suited for engineers building dense, I/O‑rich systems that require substantial local memory and reliable operation across an extended temperature range.

For projects that target complex signal processing, transceiver‑enabled data paths, or dense control logic in industrial environments, this Stratix V GX device offers a balance of integration and capacity while aligning with the technical documentation available for the Stratix V family.

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