5SGXEA4K3F35C4N

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 37888000 420000 1152-BBGA, FCBGA

Quantity 748 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs158500Number of Logic Elements/Cells420000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits37888000

Overview of 5SGXEA4K3F35C4N – Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 37888000 420000 1152-BBGA, FCBGA

The 5SGXEA4K3F35C4N is a Stratix V GX Field Programmable Gate Array (FPGA) offered in a 1152-ball FCBGA package. It provides a high-density FPGA fabric with a large number of logic resources and embedded RAM, suitable for commercial embedded and communications-oriented designs that require a programmable, high-capacity logic device.

Designed as a Stratix V GX device, this FPGA targets applications that need extensive I/O, substantial on‑chip memory, and a dense logic element count, all in a surface‑mount BGA package with commercial temperature rating.

Key Features

  • Logic Capacity  Approximately 420,000 logic elements, supporting large-scale logic integration and complex custom logic implementations.
  • Embedded Memory  Approximately 37.9 Mbits of embedded RAM for on-chip buffering, lookup tables, and state storage.
  • I/O  432 user I/O pins to support wide external interfacing and complex multi-channel system connections.
  • Package  1152-ball BGA (1152-FBGA, 35 × 35) surface-mount package that facilitates high-density board integration.
  • Power Supply  Core voltage range of 820 mV to 880 mV to match system power-rail planning for Stratix V devices.
  • Operating Conditions  Commercial temperature grade rated from 0 °C to 85 °C for typical commercial embedded environments.
  • Compliance  RoHS compliant, simplifying regulatory alignment for commercial product designs.

Unique Advantages

  • High logic density: The large logic element count enables consolidation of complex functions and reduces the need for multiple discrete devices.
  • Substantial on-chip memory: Approximately 37.9 Mbits of embedded RAM supports deep buffering and stateful processing without immediate external memory dependence.
  • Extensive I/O availability: 432 I/O pins provide flexibility for multi-protocol interfacing and system expansion.
  • Compact BGA package: The 1152-ball FCBGA (35×35) package balances board space efficiency with high pin count for dense system designs.
  • Commercial temperature rating: Rated 0 °C to 85 °C to align with standard commercial electronic product requirements.
  • RoHS conformity: RoHS compliance supports environmentally conscious product builds and regulatory needs.

Why Choose 5SGXEA4K3F35C4N?

The 5SGXEA4K3F35C4N combines a high number of logic elements with significant embedded RAM and abundant I/O in a compact 1152-ball FCBGA package, making it well-suited for commercial applications that demand dense programmable logic and on‑chip memory. Its specified core voltage range and commercial temperature rating provide clear electrical and environmental boundaries for system integration.

This Stratix V GX device is a strong option for teams designing advanced digital systems that require a scalable, high-capacity FPGA fabric backed by documented electrical and switching characteristics from the Stratix V family.

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