5SGXEA4K3F35I3

The 5SGXEA4K3F35I3 is a Stratix V GX variant FPGA built on 28-nm process technology. It combines a high-density programmable fabric with integrated high-speed transceiver capability and abundant on-chip memory to address bandwidth-centric and data-intensive applications.

Targeted uses include optical transport, packet processing and network test equipment where high logic capacity, substantial embedded memory and industrial temperature operation are required. The device provides a pathway for production scaling within the Stratix V family.

Key Features

• Core process and architecture 28-nm process technology with a redesigned adaptive logic module (ALM) and a multi-track routing fabric for complex, high-performance designs.
• Logic capacity Approximately 420,000 logic elements to implement large, multi-function digital systems.
• Embedded memory Approximately 37.9 Mbits of on-chip RAM (total RAM bits: 37,888,000) using M20K memory blocks for packet buffering, LUTs and state storage.
• High-speed transceivers Stratix V GX devices offer integrated transceivers with up to 14.1 Gbps data-rate capability for backplane and optical interfaces.
• I/O and packaging 432 user I/Os in a 1152-BBGA, FCBGA package (supplier package: 1152-FBGA, 35×35) designed for surface-mount assembly.
• DSP and timing Variable-precision DSP blocks and fractional PLLs provide flexible building blocks for high-performance signal processing and clocking.
• Power and operating range Core supply specified at 820 mV to 880 mV; industrial operating temperature range from −40 °C to 100 °C.
• Compliance RoHS compliant for environmental and manufacturing considerations.

Typical Applications

• Optical transport and line cards Use the integrated high-speed transceivers and large logic/memory resources for 40G/100G optical transport and backplane interfaces.
• Packet processing and networking Implement high-throughput packet engines, traffic management and protocol handling using abundant logic elements and embedded memory.
• Network and test equipment Leverage flexible DSP blocks and high I/O counts for instrument control, high-speed data capture and analysis in test systems.
• Military and wireline communications Industrial temperature grade and extensive I/O support deployment in communications equipment requiring robust environmental performance.

Unique Advantages

• High logic density: 420,000 logic elements enable integration of complex subsystems onto a single device, reducing board-level component count.
• Substantial on-chip RAM: Approximately 37.9 Mbits of embedded memory supports large buffers and stateful packet processing without external memory in many use cases.
• Integrated high-speed I/O: GX-class transceivers with up to 14.1 Gbps capability simplify high-bandwidth interface design for backplane and optical links.
• Industrial reliability: Rated for −40 °C to 100 °C operation and supplied in a robust FCBGA package for surface-mount applications.
• Flexible DSP and clocking: Variable-precision DSP blocks and fractional PLLs support advanced signal processing and precise timing requirements.
• RoHS compliant: Meets common environmental requirements for modern electronic assemblies.

Why Choose 5SGXEA4K3F35I3?

This Stratix V GX device delivers a balanced combination of high logic capacity, significant embedded memory and integrated high-speed transceivers—attributes well suited to bandwidth- and data-intensive system designs. Its industrial temperature rating and surface-mount FCBGA packaging align with rugged product and high-density board layouts.

Designers can leverage the Stratix V family architecture—adaptive logic modules, M20K memory blocks, DSP resources and comprehensive fabric clocking—to implement large, timing-critical systems while maintaining a clear production path within the Stratix V ecosystem.

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